公开(公告)号：US20150003020A1

公开(公告)日：2015-01-01

申请号：US14490425

申请日：2014-09-18

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Chang HONG ,  Kwang Seop YOUM ,  Bong Kyu CHOI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic component-embedded printed circuit board includes: a core substrate having a cavity; an electronic component in the cavity; an inner circuit layer formed on the core substrate; a cooling member provided on the first surface of the core substrate at a position over the cavity; and an outer insulating layer on the core substrate. In one embodiment, the cooling member is covering over a portion of the outer surface of the inner circuit layer, and is adhered to the electronic component and to the outer surface of the inner circuit layer through a conductive material.

Abstract translation: 电子元件嵌入式印刷电路板包括：具有空腔的芯基板; 空腔中的电子部件; 形成在所述芯基板上的内电路层; 设置在所述芯基板的所述第一表面上的空腔上方的位置的冷却部件; 和芯基板上的外绝缘层。 在一个实施例中，冷却构件覆盖在内部电路层的外表面的一部分上，并且通过导电材料粘附到电子部件和内部电路层的外表面。

公开(公告)号：US20140300001A1

公开(公告)日：2014-10-09

申请号：US14068628

申请日：2013-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Ryul Choi ,  Suk Chang HONG ,  Sang Kab PARK ,  Kwang Seop YOUM

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/183 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/4697 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad. A cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

Abstract translation: 印刷电路板及其制造方法以及包括印刷电路板的半导体封装。 印刷电路板包括：基底基板，其包括多个电路图案，形成在基底基板上的空腔，嵌入基底基板中并通过空腔的基板底表面露出的垫，以及安装在腔体中的电子部件 并且电连接到所述垫。 具有预定深度的空腔形成在印刷电路板的基底基板中，以便在其中安装电子元件，使得即使球之间的间距是可以获得上半导体封装和下半导体封装之间的间隙 在具有PoP结构的半导体封装的制造中，上半导体封装的高密度和高性能降低。

公开(公告)号：US20160157353A1

公开(公告)日：2016-06-02

申请号：US15014059

申请日：2016-02-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Ryul CHOI ,  Suk Chang HONG ,  Sang Kab PARK ,  Kwang Seop YOUM

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/4697 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein are a printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad.According to the present invention, a cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

Abstract translation: 这里公开了印刷电路板，其制造方法和包括印刷电路板的半导体封装。 印刷电路板包括：基底基板，其包括多个电路图案，形成在基底基板上的空腔，嵌入基底基板中并通过空腔的基板底表面露出的垫，以及安装在腔体中的电子部件 并且电连接到所述垫。 根据本发明，在印刷电路板的基底基板上形成具有预定深度的空腔，以便在其中安装电子部件，使得即使在上部半导体封装和下部半导体封装之间也可获得间隙 如果在具有PoP结构的半导体封装的制造中，球之间的间距在上半导体封装的高密度和高性能方面降低。

公开(公告)号：US20140240949A1

公开(公告)日：2014-08-28

申请号：US14079024

申请日：2013-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joong Sun KIM ,  Sang Gab PARK ,  Kwang Seop YOUM

IPC: H05K7/02

CPC classification number: H01L21/561 ,  H01L23/3107 ,  H01L23/49838 ,  H01L24/97

Abstract: Disclosed herein is a substrate strip including: a substrate region having a plurality of substrate units formed therein; a dummy region enclosing the substrate region; a plurality of metal patterns formed at a predetermined size in the dummy region; and rib patterns formed between the metal patterns.

Abstract translation: 这里公开了一种基板条，包括：基板区域，其中形成有多个基板单元; 封闭衬底区域的虚拟区域; 在虚拟区域中以预定尺寸形成的多个金属图案; 以及形成在金属图案之间的肋图案。