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    Printed circuit board
    2.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11765820B2

    公开(公告)日：2023-09-19

    申请号：US17144371

    申请日：2021-01-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Heun Lee ,  Yong Soon Jang

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

    CPC classification number: H05K1/0296 ,  H05K1/115 ,  H05K1/09 ,  H05K1/11 ,  H05K1/116 ,  H05K1/181

    Abstract: A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.

    CONNECTION STRUCTURE EMBEDDED SUBSTRATE AND SUBSTRATE STRUCTURE INCLUDING THE SAME
    5.
    发明申请
    CONNECTION STRUCTURE EMBEDDED SUBSTRATE AND SUBSTRATE STRUCTURE INCLUDING THE SAME 有权

    公开(公告)号：US20220322527A1

    公开(公告)日：2022-10-06

    申请号：US17371813

    申请日：2021-07-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hong Min ,  Ho Hyung Ham ,  Yong Soon Jang ,  Ki Suk Kim ,  Hyung Ki Lee ,  Chi Won Hwang

    IPC: H05K1/11

    Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

    Package substrate
    7.
    发明授权
    Package substrate 有权

    公开(公告)号：US11088089B2

    公开(公告)日：2021-08-10

    申请号：US16680998

    申请日：2019-11-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yoong Oh ,  Sang Hoon Kim ,  Young Kuk Ko ,  Yong Soon Jang

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/14 ,  H01L23/498 ,  H01L23/13 ,  H01L23/48 ,  H01L23/522 ,  H01L23/485 ,  H01L23/525 ,  H01L21/56

    Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.

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