公开(公告)号：US20230197415A1

公开(公告)日：2023-06-22

申请号：US17993996

申请日：2022-11-25

Applicant: SEMES CO., LTD.

Inventor： In Seong LIM ,  Loung Sue CHANG ,  Jung Yoon YANG ,  Sun Ryum LEE ,  Seung Hoon JEON ,  Kyoung Rae LEE

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32449 ,  H01J37/32568 ,  H01J37/32082 ,  H01L21/6831 ,  H01J2237/032 ,  H01J2237/335

Abstract: The present disclosure relates to a process gas supplying unit configured to uniformly supply a process gas to each region of a substrate when a substrate is treated using plasma, and a substrate treating apparatus including the same. According to the present disclosure, the effect of improving the treating efficiency of the substrate may be obtained by uniformly supplying the process gas.

公开(公告)号：US20230162949A1

公开(公告)日：2023-05-25

申请号：US17944190

申请日：2022-09-14

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon JEON ,  Loung Sue CHANG ,  Jung Yoon YANG ,  Sun Ryum LEE ,  In Seong LIM ,  Kyoung Rae LEE

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J2237/327

Abstract: An apparatus for processing a substrate is provided. The apparatus comprises a process chamber configured to define an interior space for internally processing a substrate, a substrate support unit configured to support the substrate in the interior space, a dielectric plate disposed above the substrate support unit, an antenna unit disposed over or above the dielectric plate, shaped into a frustum, having a truncated cone or prismoidal shape, and including a through-hole, a microwave application unit configured to apply microwaves to the antenna unit, and a slow-wave plate disposed on the antenna unit.