公开(公告)号：US20220199364A1

公开(公告)日：2022-06-23

申请号：US17547303

申请日：2021-12-10

Applicant: SEMES CO., LTD.

Inventor： Sun Ryum LEE ,  Loung Sue CHANG ,  Jung Yoon YANG ,  In Seong LIM ,  Seung Hoon JEON

IPC: H01J37/32

Abstract: Disclosed is a microwave application unit for applying a microwave to generate plasma. The microwave application unit includes an antenna plate disposed on the support unit and having a plurality of slots; a power supply configured to apply a microwave to the antenna plate; a dielectric plate disposed above the antenna plate to face the antenna plate; an upper plate disposed above the dielectric plate; and a transmissive plate provided below the antenna plate and configured to transmit the microwave to the processing space, wherein an adjustment groove configured to adjust an electric field is formed on an lower surface of the upper plate.

公开(公告)号：US20230197415A1

公开(公告)日：2023-06-22

申请号：US17993996

申请日：2022-11-25

Applicant: SEMES CO., LTD.

Inventor： In Seong LIM ,  Loung Sue CHANG ,  Jung Yoon YANG ,  Sun Ryum LEE ,  Seung Hoon JEON ,  Kyoung Rae LEE

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32449 ,  H01J37/32568 ,  H01J37/32082 ,  H01L21/6831 ,  H01J2237/032 ,  H01J2237/335

Abstract: The present disclosure relates to a process gas supplying unit configured to uniformly supply a process gas to each region of a substrate when a substrate is treated using plasma, and a substrate treating apparatus including the same. According to the present disclosure, the effect of improving the treating efficiency of the substrate may be obtained by uniformly supplying the process gas.

公开(公告)号：US20230162949A1

公开(公告)日：2023-05-25

申请号：US17944190

申请日：2022-09-14

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon JEON ,  Loung Sue CHANG ,  Jung Yoon YANG ,  Sun Ryum LEE ,  In Seong LIM ,  Kyoung Rae LEE

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J2237/327

Abstract: An apparatus for processing a substrate is provided. The apparatus comprises a process chamber configured to define an interior space for internally processing a substrate, a substrate support unit configured to support the substrate in the interior space, a dielectric plate disposed above the substrate support unit, an antenna unit disposed over or above the dielectric plate, shaped into a frustum, having a truncated cone or prismoidal shape, and including a through-hole, a microwave application unit configured to apply microwaves to the antenna unit, and a slow-wave plate disposed on the antenna unit.