公开(公告)号：US20160016888A1

公开(公告)日：2016-01-21

申请号：US14843274

申请日：2015-09-02

Applicant: SIKA TECHNOLOGY AG

Inventor： Juergen FINTER ,  Ulrich GERBER ,  Edis KASEMI ,  Andreas KRAMER

IPC: C07C217/44 ,  C08G73/02

CPC classification number: C07C217/44 ,  C08G14/06 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/623 ,  C08G65/2612 ,  C08G73/024 ,  C08L63/00 ,  C09D163/00 ,  C09J11/08 ,  C09J163/00

Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

公开(公告)号：US20150275059A1

公开(公告)日：2015-10-01

申请号：US14741598

申请日：2015-06-17

Applicant: SIKA TECHNOLOGY AG

Inventor： Juergen FINTER ,  Elyes JENDOUBI

IPC: C09J163/00 ,  B32B37/06 ,  C08J9/00 ,  B32B37/12

CPC classification number: C09J163/00 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/1284 ,  B32B2307/306 ,  B32B2309/02 ,  B32B2311/00 ,  B32B2605/00 ,  B32B2607/00 ,  C08G59/226 ,  C08G59/4014 ,  C08J9/0061 ,  C08J2363/00 ,  C08L63/00 ,  C08L2666/22 ,  C09J2463/00

Abstract: A hot-curing epoxy resin composition including: at least one liquid epoxy resin having an average of more than one epoxy group per molecule; at least one solid epoxy resin having an average of more than one epoxy group per molecule; at least one polymeric impact modifier comprising a functionalized, epoxy-terminated, acrylonitrile/butadiene copolymer; at least one homopolymer, solid at room temperature, of an olefinically unsaturated monomer; and at least one epoxy-resin hardener which is activated via an elevated temperature, with a proportion by weight of the polymeric impact modifier, based on the epoxy resin composition, being smaller than 20% by weight, and an amount by weight of the homopolymer, solid at room temperature, being greater than the amount by weight of the polymeric impact modifier.

Abstract translation: 一种热固化环氧树脂组合物，其包含：至少一种每分子平均具有多于一个环氧基的液体环氧树脂; 每分子平均具有多于一个环氧基团的至少一种固体环氧树脂; 至少一种聚合抗冲改性剂，其包含官能化的环氧封端的丙烯腈/丁二烯共聚物; 至少一种均聚物，在室温下为固体的烯属不饱和单体; 和至少一种通过升高的温度活化的环氧树脂硬化剂，基于环氧树脂组合物的聚合抗冲改性剂的重量比小于20重量％，并且均聚物的重量 在室温下为固体，大于聚合物抗冲改性剂的重量。

公开(公告)号：US20130253094A1

公开(公告)日：2013-09-26

申请号：US13904542

申请日：2013-05-29

Applicant: SIKA TECHNOLOGY AG

Inventor： Karsten FRICK ,  Ulrich GERBER ,  Juergen FINTER ,  Andreas KRAMER

IPC: C08G65/26

CPC classification number: C08G65/2672 ,  C08G18/3848 ,  C08G59/686 ,  Y10T428/31515

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract translation: 一种硫化环氧树脂组合物，其包含平均每分子具有多于一个环氧基的环氧树脂A; 用于环氧树脂的固化剂B，其在100℃至220℃的温度范围内活化; 和用于环氧树脂组合物的活化剂C，其中活化剂C是式（I）的化合物，或者是式（Ia）化合物与异氰酸酯或环氧化物之间的反应产物。