SHAPE MEMORY MATERIAL AND USE THEREOF FOR BONDING OF SUBSTRATES

    公开(公告)号:US20220228033A1

    公开(公告)日:2022-07-21

    申请号:US17614134

    申请日:2020-07-23

    Abstract: An adhesive article including an expandable layer composed of a shape memory polymer composition including a first curable adhesive and at least one thermoplastic elastomer and a first adhesive layer covering at least a portion of the first major surface of the expandable layer, wherein the shape memory polymer composition is in a temporary deformed shape. Further, a method for producing an adhesive article, to a method for bonding two substrates to each other, and to a two-part bonded assembly including a first substrate and a second substrate and adhesive article between the substrates.

    THERMOPLASTIC FORMULATION WITH IMPROVED ADHESION

    公开(公告)号:US20190031853A1

    公开(公告)日:2019-01-31

    申请号:US16071046

    申请日:2017-02-08

    Abstract: A thermally expandable composition, including at least one polymer P, cross-linkable by peroxide, at least one peroxide, preferably at least one acrylate, at least one blowing agent B, preferably at least one activator for the blowing agent, and at least one epoxide group terminated polymer of the formula (I), wherein Y represents a n-valent radical of a linear or branched polyurethane polymer terminated with isocyanate groups after the removal of the n terminal isocyanate groups, Z represents a (1+m)-valent radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after the removal of the hydroxyl group and m epoxide groups, m represents an integer with a value of 1, 2, or 3, and n represents an integer with a value from 2 to 4.

    ACTIVATOR FOR EPOXY RESIN COMPOSITIONS
    7.
    发明申请
    ACTIVATOR FOR EPOXY RESIN COMPOSITIONS 有权
    环氧树脂组合物的活化剂

    公开(公告)号:US20130253094A1

    公开(公告)日:2013-09-26

    申请号:US13904542

    申请日:2013-05-29

    CPC classification number: C08G65/2672 C08G18/3848 C08G59/686 Y10T428/31515

    Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

    Abstract translation: 一种硫化环氧树脂组合物,其包含平均每分子具有多于一个环氧基的环氧树脂A; 用于环氧树脂的固化剂B,其在100℃至220℃的温度范围内活化; 和用于环氧树脂组合物的活化剂C,其中活化剂C是式(I)的化合物,或者是式(Ia)化合物与异氰酸酯或环氧化物之间的反应产物。

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