公开(公告)号：US20220033568A1

公开(公告)日：2022-02-03

申请号：US17277209

申请日：2019-09-30

Applicant: SIKA TECHNOLOGY AG

Inventor： Edis KASEMI ,  Andreas KRAMER ,  Ursula STADELMANN ,  Urs BURCKHARDT ,  Ulrich GERBER

IPC: C08G59/24 ,  C08G59/50 ,  C08K3/36 ,  C08K9/04 ,  C09J163/00 ,  C09J5/00 ,  C09J11/04 ,  B32B37/12

Abstract: A hardener for epoxy resins, containing at least one amine A1 of formula (I) and at least one amine A2 of formula (II), the weight ratio of amine A1 to amine A2 ranging between 20/1 and 1/2. The hardener allows the manufacture of low-emission epoxy resin adhesives having good workability, a sufficiently long pot-life and open time with rapid curing, high strength, low brittleness, high adhesion, in particular to steel, and a sufficiently high glass transition temperature.

公开(公告)号：US20190382524A1

公开(公告)日：2019-12-19

申请号：US16469908

申请日：2017-12-07

Applicant: SIKA TECHNOLOGY AG

Inventor： Ulrich GERBER

IPC: C08G59/18 ,  C08L63/04 ,  C08K5/17 ,  C09D163/04

Abstract: An adduct AD obtained from the reaction of at least one novolak glycidyl ether containing an average of 2.5 to 4 epoxy groups per molecule with an amine mixture including bis(6-aminohexyl)amine and at least one amine A1 other than bis(6-aminohexyl)amine that has at least one primary amino group. Preferably, the amine mixture is a technical grade quality of bis(6-aminohexyl)amine that contains 25% to 82% by weight of bis(6-aminohexyl)amine. The adduct AD is preparable in a simple manner and without the use of solvents, and enables low-odor, low-toxicity and low-viscosity hardeners that can be processed and stored even under cold conditions. Epoxy resin compositions cured therewith very rapidly build up high binding forces and high strengths under ambient outdoor temperatures, even on substrates that are difficult to bond.

公开(公告)号：US20240092964A1

公开(公告)日：2024-03-21

申请号：US17768078

申请日：2020-10-20

Applicant: SIKA TECHNOLOGY AG

Inventor： Edis KASEMI ,  Ursula STADELMANN ,  Ulrich GERBER ,  Christoph MAYER ,  David ELMENDORF ,  Amy RUSSO

IPC: C08G59/50 ,  D06M13/332 ,  D06M15/55 ,  E04G23/02

CPC classification number: C08G59/5033 ,  C08G59/5006 ,  C08G59/504 ,  D06M13/332 ,  D06M15/55 ,  E04G23/0218 ,  D06M2101/40

Abstract: A method to reinforce a built structure, wherein an impregnation resin including a resin component including at least one epoxy resin and hardener component including at least one amine of the formula (I) is used to impregnate woven or stitched fabric, which is wrapped around and/or adhered onto built structure. The inventive method preferably serves to improve earthquake safety of buildings, as replacement for missing reinforcement inside concrete, for improvement of strength and ductility or for increase of payload of a built structure. It enables the application of an emission-free impregnation resin with low odour, which has a long open time and good penetration into the fabric, shows fast and reliable curing without tendency to blushing, and forms a dry, non-sticky surface. The cured impregnation resin has a high strength, a high glass transition temperature and good adhesion properties, enabling a good durability and long-term stability of the reinforced structure.

公开(公告)号：US20200087552A1

公开(公告)日：2020-03-19

申请号：US16469825

申请日：2017-12-07

Applicant: SIKA TECHNOLOGY AG

Inventor： Ulrich GERBER ,  Steffen KELCH ,  Christoph MAYER

IPC: C09J163/00 ,  C08G59/22 ,  C08G59/24 ,  C08G59/50 ,  C08G59/64 ,  C08G59/56 ,  C08K3/36 ,  C09J11/04 ,  C09J5/00

Abstract: An epoxy resin adhesive including at least one epoxy resin in the resin component, at least one adduct AD including primary amino groups which is free-flowing at room temperature and is formed from (i) at least one polyepoxide and (ii) at least one amine of the formula (I) and optionally further amines, and additionally at least one accelerator B having at least one dimethylamino group in the hardener component, and a total of at least 50% by weight of at least one inorganic filler. The epoxy resin adhesive has low odor and good processibility, rapidly builds up strength at room temperature and under cold conditions and, after curing, has high strengths, especially particularly high compressive strengths, and high bonding forces to substrates such as steel, carbon fiber composites (CRP) and concrete.

公开(公告)号：US20170240687A1

公开(公告)日：2017-08-24

申请号：US15518375

申请日：2015-10-13

Applicant: SIKA TECHNOLOGY AG

Inventor： Karsten FRICK ,  Ulrich GERBER ,  Jürgen FINTER

IPC: C08G18/80 ,  C08G18/10 ,  C08J9/10 ,  C09J175/08 ,  C08G18/75 ,  C08G18/58 ,  C08G18/40 ,  C08G18/42 ,  C08G18/08

CPC classification number: C08G18/8016 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4045 ,  C08G18/42 ,  C08G18/4216 ,  C08G18/4233 ,  C08G18/58 ,  C08G18/698 ,  C08G18/755 ,  C08G59/4028 ,  C08J9/103 ,  C08J9/105 ,  C08J9/32 ,  C08J2203/04 ,  C08J2375/04 ,  C08J2375/08 ,  C09J175/08 ,  C08G18/692 ,  C08G18/3215

Abstract: What is described is a polymer which is a polyurethane polymer having blocked isocyanate groups or a reaction product of said polyurethane polymer with at least one epoxy resin, where the polyurethane polymer having blocked isocyanate groups is an addition product formed from at least one polyisocyanate and at least one polyester polyol, wherein the isocyanate groups of the addition product have been blocked by reaction with at least one aromatic compound having at least one hydroxyl group. Such a polymer is suitable as an impact modifier in epoxy resin compositions, especially when they are used as adhesives or structural foams. The polymer improves the corrosion resistance and vertical expansion of the epoxy resin composition.

公开(公告)号：US20160016888A1

公开(公告)日：2016-01-21

申请号：US14843274

申请日：2015-09-02

Applicant: SIKA TECHNOLOGY AG

Inventor： Juergen FINTER ,  Ulrich GERBER ,  Edis KASEMI ,  Andreas KRAMER

IPC: C07C217/44 ,  C08G73/02

CPC classification number: C07C217/44 ,  C08G14/06 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/623 ,  C08G65/2612 ,  C08G73/024 ,  C08L63/00 ,  C09D163/00 ,  C09J11/08 ,  C09J163/00

Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

公开(公告)号：US20130253094A1

公开(公告)日：2013-09-26

申请号：US13904542

申请日：2013-05-29

Applicant: SIKA TECHNOLOGY AG

Inventor： Karsten FRICK ,  Ulrich GERBER ,  Juergen FINTER ,  Andreas KRAMER

IPC: C08G65/26

CPC classification number: C08G65/2672 ,  C08G18/3848 ,  C08G59/686 ,  Y10T428/31515

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract translation: 一种硫化环氧树脂组合物，其包含平均每分子具有多于一个环氧基的环氧树脂A; 用于环氧树脂的固化剂B，其在100℃至220℃的温度范围内活化; 和用于环氧树脂组合物的活化剂C，其中活化剂C是式（I）的化合物，或者是式（Ia）化合物与异氰酸酯或环氧化物之间的反应产物。