公开(公告)号：US20160322725A1

公开(公告)日：2016-11-03

申请号：US15207705

申请日：2016-07-12

Applicant: Sony Corporation

Inventor： Kazunao ONIKI

IPC: H01R12/77 ,  H01R13/66

CPC classification number: H01R12/775 ,  H01R13/665 ,  Y10T29/49204

Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.

Abstract translation: 提供传输模块，传输电缆和连接器。 传输模块包括具有连接器侧基板的连接器部件，连接器侧基板具有包括接地端子和数据端子的端子部件，以及传输电缆部件，其包括具有柔性的电缆侧基板，电缆侧接地层电连接到地面 端子和信号线，其中设置在信号线的至少下侧和上侧的电缆侧接地层被折叠，其中在连接器侧基板上设置电连接到接地端子的连接器侧接地层，并且 其中至少设置在产生电磁噪声的区域的下侧和上侧的连接器侧接地层被折叠。

公开(公告)号：US20160254622A1

公开(公告)日：2016-09-01

申请号：US15151772

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Akira AKIBA ,  Mitsuo HASHIMOTO ,  Shinya MORITA ,  Shun MITARAI ,  Mikihiro TAKETOMO ,  Kazunao ONIKI ,  Koichi IKEDA

IPC: H01R13/66 ,  H01P3/08 ,  H01R24/64

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。

公开(公告)号：US20140364004A1

公开(公告)日：2014-12-11

申请号：US14286204

申请日：2014-05-23

Applicant: Sony Corporation

Inventor： Kazunao ONIKI

IPC: H01R12/77 ,  H01R43/00

CPC classification number: H01R12/775 ,  H01R13/665 ,  Y10T29/49204

Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.

Abstract translation: 传输模块包括具有连接器侧基板的连接器部件，该连接器侧基板具有包括接地端子和数据端子的端子部件，以及安装在连接器侧基板上的信号处理部件，用于处理频率高于 经由数据终端输入或输出的数据信号; 以及传输电缆部件，用于发送包括电缆侧基板的高频信号，所述电缆侧基板具有电连接到接地端子的电缆侧接地层和传输高频信号的信号线的柔性，电缆侧 折叠作为包括电缆侧基板的电缆侧接地层的部分的至少在信号线的下侧和上侧设置接地层。

公开(公告)号：US20170170339A1

公开(公告)日：2017-06-15

申请号：US15303111

申请日：2015-04-23

Applicant: Sony Corporation

Inventor： Hiizu OOTORII ,  Kazunao ONIKI ,  Koki UCHINO ,  Hideyuki SUZUKI ,  Hiroshi OZAKI ,  Kazuki SANO ,  Eiji OTANI ,  Shinji ROKUHARA ,  Kiwamu ADACHI ,  Shuichi OKA ,  Shusaku YANAGAWA ,  Hiroshi MORITA ,  Takeshi OGURA

IPC: H01L31/0232 ,  G02B6/42

CPC classification number: H01L31/0232 ,  G02B6/4202 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/16225 ,  H01S5/02272 ,  H01S5/02288 ,  H04B10/2504

Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.