公开(公告)号：US20160254622A1

公开(公告)日：2016-09-01

申请号：US15151772

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Akira AKIBA ,  Mitsuo HASHIMOTO ,  Shinya MORITA ,  Shun MITARAI ,  Mikihiro TAKETOMO ,  Kazunao ONIKI ,  Koichi IKEDA

IPC: H01R13/66 ,  H01P3/08 ,  H01R24/64

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。