公开(公告)号：US20190277457A1

公开(公告)日：2019-09-12

申请号：US16349589

申请日：2017-12-01

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Qinghong LIN ,  Yong TANG ,  Shudong YU ,  Huiyu WANG ,  Guanwei LIANG ,  Longsheng LU

IPC: F21K9/90 ,  H01L33/48 ,  F21K99/00

Abstract: Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding. The present invention effectively prevents overheating caused by long-term and large-area contact between the lower clamp and the heating lower pressing mould, and avoids the process defect of premature melting of the fluorescent membrane due to overheating, thereby greatly improving the product consistency and yield rate of the CSP-package fluorescent membrane in the pressure molding process.

公开(公告)号：US20220293480A1

公开(公告)日：2022-09-15

申请号：US17607901

申请日：2019-11-14

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY ,  GUANGDONG LUCKYSTAR ELECTRONIC TECHNOLOGY CO., LTD ,  SHENZHEN GOOD-MACHINE AUTOMATIC EQUIPMENT CO., LTD

Inventor： Zongtao LI ,  Yong TANG ,  Hong WANG ,  Shudong YU ,  Kejian WU ,  Guanwei LIANG ,  Xinrui DING

IPC: H01L23/13 ,  H01L23/15 ,  H01L33/62

Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.