公开(公告)号：US20220316674A1

公开(公告)日：2022-10-06

申请号：US17613855

申请日：2020-07-02

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Binhai YU ,  Yong TANG ,  Caiman YAN ,  Cunjiang SONG ,  Qiliang ZHAO ,  Longshi RAO

IPC: F21S41/151 ,  F21S45/40

Abstract: The present disclosure relates to an LED vehicle lamp with a frustum base plate. The LED vehicle lamp includes a base plate, a circuit board and a plurality of LED chips. The base plate is a frustum base plate. The frustum base plate is arranged on an axis of the LED vehicle lamp. A width of an upper bottom surface of the frustum base plate is smaller than that of a lower bottom surface of the frustum base plate. An axis of the circuit board is parallel to an axis of the frustum base plate. A width of the circuit board is smaller than that of the upper bottom surface of the frustum base plate. The circuit board is installed on the upper bottom surface of the frustum base plate, and the plurality of LED chips are installed on the circuit board.

公开(公告)号：US20220241909A1

公开(公告)日：2022-08-04

申请号：US17401327

申请日：2021-08-13

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zhenping WAN ,  Zicong HE ,  Jinhu ZOU ,  Longsheng LU ,  Yong TANG

IPC: B23P15/26

Abstract: A method for sealing a high-temperature heat pipe includes: (1) necking and reducing two ends of the heat pipe separately, so as to obtain a necked end and a reduced end; (2) sealing the necked end by laser welding or electron beam welding; (3) placing the heat pipe in an inert gas glove box, and pouring a working medium without impurities into the heat pipe; (4) heating the heat pipe, connecting the reduced end to a vacuum pump, pumping gas inside the heat pipe by the vacuum pump to vacuumize the heat pipe, such that pressure in an inner cavity of the heat pipe reaches a target pressure, and flattening the reduced end; and (5) sealing an opening of the flattened reduced end by electron beam welding or laser welding, so as to obtain the high-temperature heat pipe.

公开(公告)号：US20190326797A1

公开(公告)日：2019-10-24

申请号：US16435490

申请日：2019-06-08

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Yong TANG ,  Yalong SUN ,  Wei YUAN ,  Longsheng LU ,  Zongtao LI ,  Zhenping WAN

IPC: H02K9/20 ,  H02K5/18 ,  F28D15/04

Abstract: A high thermal conductivity stator component for vehicle motor based on 3D phase change heat pipe technology of the present invention includes a casing, a 3D phase change heat pipe, a stator core and a stator winding; the casing includes assembly passages for the 3D phase change heat pipe; the 3D phase change heat pipe assembly passages are symmetrically arranged on both sides of the casing body; a condensation section of the 3D phase change heat pipe is assembled in the assembly passages of the casing body, and an evaporation section is bonded to the stator winding. The present invention provides a high thermal conductivity stator component for vehicle motor with a simple structure, convenient installation, wide application and low cost.

公开(公告)号：US20220293480A1

公开(公告)日：2022-09-15

申请号：US17607901

申请日：2019-11-14

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY ,  GUANGDONG LUCKYSTAR ELECTRONIC TECHNOLOGY CO., LTD ,  SHENZHEN GOOD-MACHINE AUTOMATIC EQUIPMENT CO., LTD

Inventor： Zongtao LI ,  Yong TANG ,  Hong WANG ,  Shudong YU ,  Kejian WU ,  Guanwei LIANG ,  Xinrui DING

IPC: H01L23/13 ,  H01L23/15 ,  H01L33/62

Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

公开(公告)号：US20210159506A1

公开(公告)日：2021-05-27

申请号：US17046803

申请日：2018-10-31

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Wei YUAN ,  Zhiqiang QIU ,  Baoyou PAN ,  Jian LUO ,  Shimin HUANG ,  Yong TANG

IPC: H01M4/66 ,  H01M10/0525 ,  H01M4/72

Abstract: Disclosed are a composite microstructured current collector for a lithium ion battery and a fabricating method therefor. The composite microstructured current collector comprises a smooth bottom surface (9) and a top surface with a composite microstructure. The top surface comprises micro protrusions (10) and grooves (11), and the micro protrusions (10) are surrounded by the grooves (11). The micro protrusions (10) are provided with concave holes, scaly burrs, and sunken structures. The fabricating method comprises the following steps: (1) design of a cutter and pretreatment of a copper sheet; and (2) processing of a surface microstructure by plowing.

公开(公告)号：US20220254971A1

公开(公告)日：2022-08-11

申请号：US17625375

申请日：2020-07-10

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Xinrui DING ,  Hanguang LU ,  Yong TANG ,  Kai CAO ,  Longshi RAO ,  Hong WANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00 ,  H01L33/44

Abstract: An inorganic ultraviolet LED device, includes a bracket, a curved lens, a press ring, a wire and an ultraviolet chip. A “T”-shaped recess is formed on the upper end of the bracket. The ultraviolet chip is fixed within the recess and connected to a welding layer at the lower end of the bracket through the wire. The curved lens is placed on a step of the recess. An inclined surface is formed on a contact surface of the step contacting with the curved lens. One end of the press ring is connected to the bracket, and the other end thereof presses against the curved lens. Deformation of the press ring is implemented under a pressure action of a pressure head, thereby implementing high-strength bonding of the device. Self-positioning is achieved through a curved surface of the lens and the contact with the inclined surface of the bracket.

公开(公告)号：US20190039115A1

公开(公告)日：2019-02-07

申请号：US16153777

申请日：2018-10-07

Applicant: South China University of Technology

Inventor： Zhenping WAN ,  Shufeng HUANG ,  Shuiping ZOU ,  Longsheng LU ,  Yong TANG

IPC: B21D53/06 ,  B23P15/26 ,  F28F1/40 ,  F28F1/36 ,  F28F21/08

Abstract: A device for forming inside three-dimensional finned tube by multi-edge ploughing and extruding, comprises a machine frame, a machine head, a supporting mechanism, an axial feeding mechanism and a cutter assembly for forming inside fins. The machine head, the supporting mechanism and the axial feeding mechanism are axially mounted on the machine frame in sequence. The cutter assembly for forming inside fins is mounted on the feeding mechanism. One end of a metal tube to be machined for forming inside three-dimensional fins is clamped on a chunk of a rotary main shaft of the machine head, and the other end thereof is placed on the supporting mechanism. The rotary main shaft of the machine head provides the rotation power for the metal tube, and the axial feeding mechanism drives the cutter assembly to move linearly along a coaxial line of the metal tube and the cutter assembly.

公开(公告)号：US20190277457A1

公开(公告)日：2019-09-12

申请号：US16349589

申请日：2017-12-01

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Qinghong LIN ,  Yong TANG ,  Shudong YU ,  Huiyu WANG ,  Guanwei LIANG ,  Longsheng LU

IPC: F21K9/90 ,  H01L33/48 ,  F21K99/00

Abstract: Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding. The present invention effectively prevents overheating caused by long-term and large-area contact between the lower clamp and the heating lower pressing mould, and avoids the process defect of premature melting of the fluorescent membrane due to overheating, thereby greatly improving the product consistency and yield rate of the CSP-package fluorescent membrane in the pressure molding process.