公开(公告)号：US20220293480A1

公开(公告)日：2022-09-15

申请号：US17607901

申请日：2019-11-14

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY ,  GUANGDONG LUCKYSTAR ELECTRONIC TECHNOLOGY CO., LTD ,  SHENZHEN GOOD-MACHINE AUTOMATIC EQUIPMENT CO., LTD

Inventor： Zongtao LI ,  Yong TANG ,  Hong WANG ,  Shudong YU ,  Kejian WU ,  Guanwei LIANG ,  Xinrui DING

IPC: H01L23/13 ,  H01L23/15 ,  H01L33/62

Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

公开(公告)号：US20220254971A1

公开(公告)日：2022-08-11

申请号：US17625375

申请日：2020-07-10

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Xinrui DING ,  Hanguang LU ,  Yong TANG ,  Kai CAO ,  Longshi RAO ,  Hong WANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00 ,  H01L33/44

Abstract: An inorganic ultraviolet LED device, includes a bracket, a curved lens, a press ring, a wire and an ultraviolet chip. A “T”-shaped recess is formed on the upper end of the bracket. The ultraviolet chip is fixed within the recess and connected to a welding layer at the lower end of the bracket through the wire. The curved lens is placed on a step of the recess. An inclined surface is formed on a contact surface of the step contacting with the curved lens. One end of the press ring is connected to the bracket, and the other end thereof presses against the curved lens. Deformation of the press ring is implemented under a pressure action of a pressure head, thereby implementing high-strength bonding of the device. Self-positioning is achieved through a curved surface of the lens and the contact with the inclined surface of the bracket.

公开(公告)号：US20240125699A1

公开(公告)日：2024-04-18

申请号：US18264988

申请日：2021-10-19

Applicant: South China University of Technology

Inventor： Zongtao LI ,  Hong WANG ,  Yongheng XING ,  Jiasheng LI ,  Jiexin LI ,  Zhou LU ,  Junhao WU

IPC: G01N21/63 ,  B01L3/00 ,  G01N21/01 ,  G01N21/31

CPC classification number: G01N21/63 ,  B01L3/502707 ,  G01N21/01 ,  G01N21/31 ,  B01L2200/147 ,  B01L2300/0816 ,  B01L2300/163

Abstract: A microfluidic ion detection chip having a bubble brightening structure includes a substrate, an upper plate, two glass cover plates, and a foam board. The substrate is provided with a fluid mixing region, a lower optical detection through hole, and a lower gas flow channel. The upper plate is adhesively connected to the substrate and is provided with a sample outlet, an upper optical detection through hole, an upper gas flow channel, and two sample inlets, the upper gas flow channel and the lower gas flow channel are combined to form a gas flow channel. The two glass cover plates are respectively disposed at the lower optical detection through hole and the upper optical detection through hole. The foam board is provided with a foaming structure capable of generating bubbles and a surfactant coated on the foam board, the foam board is disposed at the gas flow channel.

公开(公告)号：US20250113677A1

公开(公告)日：2025-04-03

申请号：US18723738

申请日：2022-11-15

Applicant: South China University of Technology

Inventor： Zongtao LI ,  Xinrui DING ,  Jiasheng LI ,  Changkun SHAO

IPC: H10H20/855 ,  H10H20/01 ,  H10H20/85 ,  H10H20/857

Abstract: A high-contrast display screen LED device and a manufacturing method therefor are disclosed. The LED device includes a housing including a bottom and a side wall, the bottom and the side wall forming a unit cavity with an opening; an LED chip arranged in the unit cavity; a transparent encapsulation layer covering the LED chip; a lens arranged on the encapsulation layer, a position of the lens is corresponding to a position of the LED chip; and an opaque light shield layer covering the encapsulation layer and partially wrapped around the lens; light from the LED chip is emitted after being converged by the lens.

公开(公告)号：US20190277457A1

公开(公告)日：2019-09-12

申请号：US16349589

申请日：2017-12-01

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Qinghong LIN ,  Yong TANG ,  Shudong YU ,  Huiyu WANG ,  Guanwei LIANG ,  Longsheng LU

IPC: F21K9/90 ,  H01L33/48 ,  F21K99/00

Abstract: Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding. The present invention effectively prevents overheating caused by long-term and large-area contact between the lower clamp and the heating lower pressing mould, and avoids the process defect of premature melting of the fluorescent membrane due to overheating, thereby greatly improving the product consistency and yield rate of the CSP-package fluorescent membrane in the pressure molding process.

公开(公告)号：US20220316674A1

公开(公告)日：2022-10-06

申请号：US17613855

申请日：2020-07-02

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Zongtao LI ,  Binhai YU ,  Yong TANG ,  Caiman YAN ,  Cunjiang SONG ,  Qiliang ZHAO ,  Longshi RAO

IPC: F21S41/151 ,  F21S45/40

Abstract: The present disclosure relates to an LED vehicle lamp with a frustum base plate. The LED vehicle lamp includes a base plate, a circuit board and a plurality of LED chips. The base plate is a frustum base plate. The frustum base plate is arranged on an axis of the LED vehicle lamp. A width of an upper bottom surface of the frustum base plate is smaller than that of a lower bottom surface of the frustum base plate. An axis of the circuit board is parallel to an axis of the frustum base plate. A width of the circuit board is smaller than that of the upper bottom surface of the frustum base plate. The circuit board is installed on the upper bottom surface of the frustum base plate, and the plurality of LED chips are installed on the circuit board.

公开(公告)号：US20190326797A1

公开(公告)日：2019-10-24

申请号：US16435490

申请日：2019-06-08

Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY

Inventor： Yong TANG ,  Yalong SUN ,  Wei YUAN ,  Longsheng LU ,  Zongtao LI ,  Zhenping WAN

IPC: H02K9/20 ,  H02K5/18 ,  F28D15/04

Abstract: A high thermal conductivity stator component for vehicle motor based on 3D phase change heat pipe technology of the present invention includes a casing, a 3D phase change heat pipe, a stator core and a stator winding; the casing includes assembly passages for the 3D phase change heat pipe; the 3D phase change heat pipe assembly passages are symmetrically arranged on both sides of the casing body; a condensation section of the 3D phase change heat pipe is assembled in the assembly passages of the casing body, and an evaporation section is bonded to the stator winding. The present invention provides a high thermal conductivity stator component for vehicle motor with a simple structure, convenient installation, wide application and low cost.