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    Electrostatic chuck device
    1.
    发明授权
    Electrostatic chuck device 有权
    静电吸盘装置

    公开(公告)号：US09209061B2

    公开(公告)日：2015-12-08

    申请号：US14345967

    申请日：2012-09-26

    Applicant: Sumitomo Osaka Cement Co., Ltd.

    Inventor： Ryuuji Hayahara ,  Kazunori Ishimura ,  Mamoru Kosakai

    IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/6831

    Abstract: An electrostatic chuck device is provided in which it is possible to uniformize an in-plane temperature distribution in a placement surface on which a plate-shaped sample such as a wafer is placed and it is possible to improve in-plane uniformity of plasma etching of the plate-shaped sample by uniformizing plasma density on the plate-shaped sample. The electrostatic chuck device includes an electrostatic chuck section that has an upper surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling base section that cools the electrostatic chuck section, wherein a heater element (4) having a heater pattern (21) of a predetermined shape is provided between the electrostatic chuck section and the cooling base section, and an island-shaped portion (24) that is independent from the heater pattern (21) and is made of the same material as the heater pattern (21) is provided in a gap portion (23) of the heater pattern (21).

    Abstract translation: 提供了一种静电卡盘装置，其中可以使诸如晶片的板状样品的放置表面中的面内温度分布均匀化，并且可以提高等离子体蚀刻的面内均匀性 该板状样品通过使板状样品上的等离子体密度均匀化。 静电吸盘装置包括具有上表面作为放置表面的板状样品的静电吸盘部，并且具有内置静电吸附用内部电极和冷却基部 静电吸盘部分，其中具有预定形状的加热器图案（21）的加热器元件（4）设置在静电吸盘部分和冷却基部之间，岛形部分（24）独立于 加热器图案（21）由与加热器图案（21）的间隙部分（23）中的加热器图案（21）相同的材料制成。

    Electrostatic chuck device
    2.
    发明授权
    Electrostatic chuck device 有权

    公开(公告)号：US10923381B2

    公开(公告)日：2021-02-16

    申请号：US16070478

    申请日：2017-01-18

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru Kosakai ,  Yukio Miura ,  Kazunori Ishimura ,  Keisuke Maeda ,  Hitoshi Kouno ,  Yuuki Kinpara ,  Shinichi Maeta ,  Tomomi Ito

    IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H02N13/00

    Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

    ELECTROSTATIC CHUCK DEVICE
    3.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 有权
    静电切割装置

    公开(公告)号：US20140301010A1

    公开(公告)日：2014-10-09

    申请号：US14345967

    申请日：2012-09-26

    Applicant: Sumitomo Osaka Cement Co., Ltd.

    Inventor： Ryuuji Hayahara ,  Kazunori Ishimura ,  Mamoru Kosakai

    IPC: H01L21/683

    CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/6831

    Abstract: An electrostatic chuck device is provided in which it is possible to uniformize an in-plane temperature distribution in a placement surface on which a plate-shaped sample such as a wafer is placed and it is possible to improve in-plane uniformity of plasma etching of the plate-shaped sample by uniformizing plasma density on the plate-shaped sample. The electrostatic chuck device includes an electrostatic chuck section that has an upper surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling base section that cools the electrostatic chuck section, wherein a heater element (4) having a heater pattern (21) of a predetermined shape is provided between the electrostatic chuck section and the cooling base section, and an island-shaped portion (24) that is independent from the heater pattern (21) and is made of the same material as the heater pattern (21) is provided in a gap portion (23) of the heater pattern (21).

    Abstract translation: 提供了一种静电卡盘装置，其中可以使诸如晶片的板状样品放置在的放置表面中的面内温度分布均匀化，并且可以提高等离子体蚀刻的面内均匀性 该板状样品通过使板状样品上的等离子体密度均匀化。 静电吸盘装置包括具有上表面作为放置表面的板状样品的静电吸盘部，并且具有内置静电吸附用内部电极和冷却基部 静电吸盘部分，其中具有预定形状的加热器图案（21）的加热器元件（4）设置在静电吸盘部分和冷却基部之间，岛形部分（24）独立于 加热器图案（21）由与加热器图案（21）的间隙部分（23）中的加热器图案（21）相同的材料制成。

    Electrostatic chuck device, and semiconductor manufacturing device
    4.
    发明授权
    Electrostatic chuck device, and semiconductor manufacturing device 有权

    公开(公告)号：US10475688B2

    公开(公告)日：2019-11-12

    申请号：US15550205

    申请日：2016-02-03

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Kazunori Ishimura ,  Kazuto Ando ,  Kentaro Takahashi ,  Yuhki Kinpara ,  Shinichi Maeta ,  Mamoru Kosakai

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

    Abstract: An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

    Electrostatic chuck device
    6.
    发明授权
    Electrostatic chuck device 有权

    公开(公告)号：US11348819B2

    公开(公告)日：2022-05-31

    申请号：US16958094

    申请日：2018-12-11

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Yuuki Kinpara ,  Ryuuji Hayahara ,  Kazunori Ishimura ,  Hitoshi Kouno

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H02N13/00

    Abstract: An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, an electrostatic attraction electrode; a base part configured to cool the electrostatic chuck part; a heater disposed in a layered manner between the electrostatic chuck part and the base part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the insulator located on the electrostatic chuck part side is separated from the electrostatic chuck part with a space interposed therebetween.

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