公开(公告)号：US11471987B2

公开(公告)日：2022-10-18

申请号：US17264705

申请日：2019-08-02

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke Maeda ,  Masaki Ozaki ,  Masayuki Shiojiri ,  Takeshi Watanabe ,  Shinichi Maeta ,  Yuuki Kinpara

IPC: B23Q3/15 ,  H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 μm to 10 μm, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm2.

公开(公告)号：US10256131B2

公开(公告)日：2019-04-09

申请号：US15752863

申请日：2016-08-09

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru Kosakai ,  Shinichi Maeta ,  Keisuke Maeda

IPC: H01L21/683 ,  H01L21/3065 ,  H02N13/00 ,  B23Q3/15 ,  H01L21/67

Abstract: An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

公开(公告)号：US10923381B2

公开(公告)日：2021-02-16

申请号：US16070478

申请日：2017-01-18

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru Kosakai ,  Yukio Miura ,  Kazunori Ishimura ,  Keisuke Maeda ,  Hitoshi Kouno ,  Yuuki Kinpara ,  Shinichi Maeta ,  Tomomi Ito

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H02N13/00

Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

公开(公告)号：US11664261B2

公开(公告)日：2023-05-30

申请号：US16649611

申请日：2018-09-12

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru Kosakai ,  Masaki Ozaki ,  Keisuke Maeda

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01J37/3255 ,  H01J37/32697 ,  H01J37/32706 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/68714

Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.

公开(公告)号：US10472488B2

公开(公告)日：2019-11-12

申请号：US15558564

申请日：2016-05-10

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Ryo Kikuta ,  Keisuke Maeda

IPC: C08K3/22 ,  C08J7/04 ,  C08L101/12

Abstract: Provided is a transparent resin composition having a higher heat ray-shielding effect that can particularly effectively shield light of a wavelength of 1,450 nm to 1,750 nm while ensuring a high visible light transmittance. The transparent resin composition contains a transparent resin-forming component and inorganic particles, in which the inorganic particles contain indium tin oxide (ITO) and have a color having an L* value of 30 or more and 55 or less and a b* value of −18 or more and −10 or less in the Lab color space.

公开(公告)号：US12280578B2

公开(公告)日：2025-04-22

申请号：US18022268

申请日：2021-08-30

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke Maeda ,  Yuuki Kinpara

IPC: B32B37/12 ,  B32B7/12 ,  B32B9/04 ,  H01L21/683

Abstract: A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive.

公开(公告)号：US11887877B2

公开(公告)日：2024-01-30

申请号：US16649969

申请日：2018-09-26

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru Kosakai ,  Masaki Ozaki ,  Keisuke Maeda

IPC: H01L21/683 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/768 ,  H01J37/32 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01J37/32091 ,  H01L21/3065 ,  H01L21/67098 ,  H01L21/76826 ,  H02N13/00

Abstract: An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×1010Ω/□.