Electrostatic chuck device
    1.
    发明授权

    公开(公告)号:US10923381B2

    公开(公告)日:2021-02-16

    申请号:US16070478

    申请日:2017-01-18

    Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

    ELECTROSTATIC CHUCK DEVICE
    2.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 有权
    静电切割装置

    公开(公告)号:US20140301010A1

    公开(公告)日:2014-10-09

    申请号:US14345967

    申请日:2012-09-26

    CPC classification number: H01L21/6833 H01L21/67109 H01L21/6831

    Abstract: An electrostatic chuck device is provided in which it is possible to uniformize an in-plane temperature distribution in a placement surface on which a plate-shaped sample such as a wafer is placed and it is possible to improve in-plane uniformity of plasma etching of the plate-shaped sample by uniformizing plasma density on the plate-shaped sample. The electrostatic chuck device includes an electrostatic chuck section that has an upper surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling base section that cools the electrostatic chuck section, wherein a heater element (4) having a heater pattern (21) of a predetermined shape is provided between the electrostatic chuck section and the cooling base section, and an island-shaped portion (24) that is independent from the heater pattern (21) and is made of the same material as the heater pattern (21) is provided in a gap portion (23) of the heater pattern (21).

    Abstract translation: 提供了一种静电卡盘装置,其中可以使诸如晶片的板状样品放置在的放置表面中的面内温度分布均匀化,并且可以提高等离子体蚀刻的面内均匀性 该板状样品通过使板状样品上的等离子体密度均匀化。 静电吸盘装置包括具有上表面作为放置表面的板状样品的静电吸盘部,并且具有内置静电吸附用内部电极和冷却基部 静电吸盘部分,其中具有预定形状的加热器图案(21)的加热器元件(4)设置在静电吸盘部分和冷却基部之间,岛形部分(24)独立于 加热器图案(21)由与加热器图案(21)的间隙部分(23)中的加热器图案(21)相同的材料制成。

    Electrostatic chuck device
    4.
    发明授权

    公开(公告)号:US10256131B2

    公开(公告)日:2019-04-09

    申请号:US15752863

    申请日:2016-08-09

    Abstract: An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

    Electrostatic chuck device
    5.
    发明授权
    Electrostatic chuck device 有权
    静电吸盘装置

    公开(公告)号:US09209061B2

    公开(公告)日:2015-12-08

    申请号:US14345967

    申请日:2012-09-26

    CPC classification number: H01L21/6833 H01L21/67109 H01L21/6831

    Abstract: An electrostatic chuck device is provided in which it is possible to uniformize an in-plane temperature distribution in a placement surface on which a plate-shaped sample such as a wafer is placed and it is possible to improve in-plane uniformity of plasma etching of the plate-shaped sample by uniformizing plasma density on the plate-shaped sample. The electrostatic chuck device includes an electrostatic chuck section that has an upper surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling base section that cools the electrostatic chuck section, wherein a heater element (4) having a heater pattern (21) of a predetermined shape is provided between the electrostatic chuck section and the cooling base section, and an island-shaped portion (24) that is independent from the heater pattern (21) and is made of the same material as the heater pattern (21) is provided in a gap portion (23) of the heater pattern (21).

    Abstract translation: 提供了一种静电卡盘装置,其中可以使诸如晶片的板状样品的放置表面中的面内温度分布均匀化,并且可以提高等离子体蚀刻的面内均匀性 该板状样品通过使板状样品上的等离子体密度均匀化。 静电吸盘装置包括具有上表面作为放置表面的板状样品的静电吸盘部,并且具有内置静电吸附用内部电极和冷却基部 静电吸盘部分,其中具有预定形状的加热器图案(21)的加热器元件(4)设置在静电吸盘部分和冷却基部之间,岛形部分(24)独立于 加热器图案(21)由与加热器图案(21)的间隙部分(23)中的加热器图案(21)相同的材料制成。

    Electrostatic chuck device, and semiconductor manufacturing device

    公开(公告)号:US10475688B2

    公开(公告)日:2019-11-12

    申请号:US15550205

    申请日:2016-02-03

    Abstract: An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

    Electrostatic chuck device
    7.
    发明授权

    公开(公告)号:US10475687B2

    公开(公告)日:2019-11-12

    申请号:US15528026

    申请日:2015-11-19

    Abstract: An aspect of the present invention has an object to provide an electrostatic chuck device which is provided with a plurality of divided heaters and in which uniform temperature control of a zone which is heated by each heater can be performed with a simple configuration. An electrostatic chuck device according to an aspect of the present invention includes: an electrostatic chuck part which has a mounting surface on one principal surface thereof to mount a plate-shaped sample and has an electrode for electrostatic attraction; a temperature controlling base part which is provided at a side opposite to the mounting surface of the electrostatic chuck part and is configured to cool the electrostatic chuck part; a high frequency generating electrode which is provided in a layer between the electrostatic chuck part and the temperature controlling base part; a high frequency power source which is connected to the high frequency generating electrode; a first heater element which is configured with a plurality of main heaters which are provided in a layer between the high frequency generating electrode and the temperature controlling base part; and a guard electrode which is provided in a layer between the high frequency generating electrode and the first heater element.

    ELECTROSTATIC CHUCK DEVICE
    9.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 有权
    静电切割装置

    公开(公告)号:US20140355169A1

    公开(公告)日:2014-12-04

    申请号:US14286898

    申请日:2014-05-23

    Abstract: An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced.In an electrostatic chuck device 1 provided with an electrostatic chuck section 2 which has a placement plate 11, an upper surface 11a of which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plate 12 integrated with the placement plate 11, and an internal electrode for electrostatic adsorption 13 and an insulating material layer 14 which are provided between the placement plate 11 and the support plate 12, an annular projection portion 21 is provided at a peripheral border portion on the upper surface 11a, a plurality of projection portions 22 having the same height as the height of the annular projection portion 21 are provided in an area surrounded by the annular projection portion 21 of the upper surface 11a, and an upper end portion of the annular projection portion 21 and an upper end portion of each of the plurality of projection portions 22 are located on a concave surface 23 with a central portion of the upper surface 11a as a basal plane.

    Abstract translation: 提供了一种静电卡盘装置,其中不考虑板状样品在吸附板状样品时可能变形,或者当分离板状样品时,板状样品的温度均匀化,颗粒的颗粒 不容易生产。 在设置有具有放置板11的静电卡盘部2的静电卡盘装置1中,其上表面11a是放置有诸如半导体晶片的板状样品W的放置表面,支撑板12 与放置板11和设置在放置板11和支撑板12之间的静电吸附用内部电极13和绝缘材料层14一体化的环状突起部21设置在上部的周边边界部 表面11a,在由上表面11a的环形突出部分21围绕的区域中设置有与环形突出部分21的高度相同高度的多个突出部分22,并且环形突起部分的上端部分 21,并且多个突出部22中的每一个的上端部位于凹面23上,上表面的中心部分 11a作为基础飞机。

    Electrostatic chuck device
    10.
    发明授权

    公开(公告)号:US11664261B2

    公开(公告)日:2023-05-30

    申请号:US16649611

    申请日:2018-09-12

    Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.

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