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    NOISE-REDUCED CAPACITIVE SENSING UNIT
    1.
    发明申请
    NOISE-REDUCED CAPACITIVE SENSING UNIT 审中-公开

    公开(公告)号：US20180074004A1

    公开(公告)日：2018-03-15

    申请号：US15702814

    申请日：2017-09-13

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chi-Chou LIN ,  Zheng-Ping HE

    IPC: G01N27/22

    CPC classification number: G01N27/228 ,  G06F3/0418 ,  G06F3/044 ,  G06K9/0002

    Abstract: A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.

    METHOD FOR MOUNTING CHIP ON PRINTED CIRCUIT BOARD
    3.
    发明申请
    METHOD FOR MOUNTING CHIP ON PRINTED CIRCUIT BOARD 有权
    印刷电路板上安装芯片的方法

    公开(公告)号：US20160079289A1

    公开(公告)日：2016-03-17

    申请号：US14488814

    申请日：2014-09-17

    Applicant: SUNASIC TECHNOLOGIES, INC.

    Inventor： Chi-Chou LIN ,  Zheng-Ping HE

    IPC: H01L27/146

    CPC classification number: H01L27/1469 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L27/146 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/484 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153

    Abstract: A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.

    Abstract translation: 公开了一种将芯片安装在印刷电路板（PCB）上的方法。 该方法包括以下步骤：提供具有多个接合焊盘的芯片和具有凹部和多个连接器的PCB; 胶合所述凹部; 将所述芯片放置在所述凹部中; 以及形成连接相关联的焊盘和连接器的电路图案。 凹部的底部基本上是平坦的，并且凹部的形状与芯片的形状相似但足够大，使得芯片可以在胶合之后固定在凹部中。

    REMOTE CONTROL FOR SMART TV AND SET-TOP BOX
    5.
    发明申请
    REMOTE CONTROL FOR SMART TV AND SET-TOP BOX 有权
    智能电视和机顶盒的远程控制

    公开(公告)号：US20160373800A1

    公开(公告)日：2016-12-22

    申请号：US15070295

    申请日：2016-03-15

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chi-Chou LIN ,  Zheng-Ping HE

    IPC: H04N21/422 ,  G06K9/00 ,  H04N21/4415

    CPC classification number: H04N21/42222 ,  G06K9/0002 ,  G06K9/00093 ,  G08C17/02 ,  G08C23/04 ,  G08C2201/30 ,  G08C2201/61 ,  H04N21/4415 ,  H04N21/4751

    Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.

    Abstract translation: 公开了一种用于智能电视或机顶盒的遥控器。 遥控器包括电容式指纹传感器，处理器和无线发射器。 本发明利用电容指纹传感器的优势，使得每个用户的个人数据和智能电视或机顶盒的相应设置都可用。 渠道（或网站）内容评级可以实现。 通过电视采购比以往任何时候都安全。

    Contactor For Testing Electronic Device
    7.
    发明申请
    Contactor For Testing Electronic Device 有权

    公开(公告)号：US20210239733A1

    公开(公告)日：2021-08-05

    申请号：US16780595

    申请日：2020-02-03

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chi-Chou LIN ,  Hsien-Hsueh LEE ,  Zheng-Ping HE

    IPC: G01R1/04 ,  H05K1/11 ,  H05K1/09 ,  G01R1/073

    Abstract: An electronic device having a structure that electrically connects the contactor to an electronic device during a testing process is disclosed. The contactor includes a holder for accommodating the electronic device during the testing process; a flexible circuit, having a first set of contacts electrically connected to the corresponding electrode terminals of the electronic device, and a second set of contacts electrically connected to a control unit that sends test signals during the test process; an elastomer, for adjusting the pressure between the first set of contacts of the flexible circuit and the corresponding electrode terminals of the electronic device while being pressed together; and an alignment tool, for aligning the first set of contacts with the corresponding electrode terminals of the electronic device. The electrode terminals of the electronic device are located on the same surface of the electronic device and the flexible circuit is detachable from the contactor.

    SILICON WAFER HAVING COLORED TOP SIDE
    8.
    发明申请
    SILICON WAFER HAVING COLORED TOP SIDE 审中-公开
    具有彩色顶面的硅胶

    公开(公告)号：US20150185378A1

    公开(公告)日：2015-07-02

    申请号：US14141717

    申请日：2013-12-27

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chi-Chou LIN ,  Zheng-Ping HE

    IPC: G02B5/18 ,  G02B1/02

    CPC classification number: G02B1/005 ,  G02B5/1842 ,  G02B5/203 ,  H01L2933/0083

    Abstract: A silicon wafer having colored top side is disclosed in the present invention. The silicon wafer includes: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures. The first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams. The present invention provides a silicon wafer which can reflect specified color(s) from the surface facing external light beams. Therefore, dies from cutting the silicon wafer with functions to interact with external environment rather than packaged can have advantages to show some specified logo or trademark.

    Abstract translation: 在本发明中公开了具有彩色顶侧的硅晶片。 硅晶片包括：晶片; 第一半导体层，形成在晶片的顶侧的至少一部分上，具有周期结构以形成光栅图案;以及第二半导体层，形成在第一半导体层上，底部侧 与周期性结构基本完全接触。 第一半导体层和第二半导体层形成光子晶体层并且用于反射入射的可见光束的预定波长范围。 本发明提供一种可以从面向外部光束的表面反射特定颜色的硅晶片。 因此，切割硅晶片具有与外部环境相互作用而不是封装的功能，具有显示某些特定标志或商标的优点。

    SENSING CHIP PACKAGE HAVING ESD PROTECTION AND METHOD MAKING THE SAME
    9.
    发明申请
    SENSING CHIP PACKAGE HAVING ESD PROTECTION AND METHOD MAKING THE SAME 审中-公开

    公开(公告)号：US20180102330A1

    公开(公告)日：2018-04-12

    申请号：US15291111

    申请日：2016-10-12

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chung-Hao HSIEH ,  Chi-Chou LIN ,  Zheng-Ping HE

    IPC: H01L23/60 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

    Abstract: A chip package having ESD protection and a method for making the chip are disclosed. The chip package includes a chip and a substrate. The chip includes a number of I/O pads each connected to a corresponding I/O contact via a first bonding wire. It also includes a number of ESD protective pads each connected to a corresponding ESD contact via a second bonding wire. Bonding wires connecting the ESD protective pads and the ESD contacts have vertexes closer to the top surface of the chip than the vertexes of the bonding wires connecting the I/O pads and the I/O contacts. Hence, a perfect ESD protection effect is achieved by leading the ESD through the bonding wires to the ESD contacts rather than via the I/O contacts.

    CAPACITIVE FINGERPRINT SENSING UNIT AND ENHANCED CAPACITIVE FINGERPRINT READER
    10.
    发明申请
    CAPACITIVE FINGERPRINT SENSING UNIT AND ENHANCED CAPACITIVE FINGERPRINT READER 审中-公开

    公开(公告)号：US20170161536A1

    公开(公告)日：2017-06-08

    申请号：US14958982

    申请日：2015-12-04

    Applicant: SunASIC Technologies, Inc.

    Inventor： Chi-Chou LIN ,  Zheng-Ping HE

    IPC: G06K9/00

    CPC classification number: G06K9/0002 ,  G06K9/00053 ,  G06K9/0008

    Abstract: A capacitive fingerprint sensing unit and enhanced capacitive fingerprint reader using the capacitive fingerprint sensing units are disclosed. The enhanced capacitive fingerprint reader includes a number of capacitive fingerprint sensing units, forming a fingerprint sensing array; a conductive element; and an excitation signal driver, for providing excitation signals to the conductive element. By increasing the thicknesses of a first inter-metal dielectric layer and a second inter-metal dielectric layer in fingerprint sensing units in the enhanced capacitive fingerprint reader, sensitivity of the enhanced capacitive fingerprint reader can be improved.

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