Abstract:
Disclosed is an apparatus for optical emission spectroscopy which includes a light measuring unit measuring light in a process chamber performing a plasma process on a substrate, a light analyzing unit receiving light collected from the light measuring unit to analyze a plasma state, a control unit receiving an output signal of the light analyzing unit to process the output signal, and a light collecting controller disposed between the process chamber and the light measuring unit so as to be combined with the light measuring unit. The light collecting controller controls the light collected to the light measuring unit.
Abstract:
A plasma processing apparatus is provided. The plasma processing apparatus includes a chamber configured to perform a plasma process on a wafer, a viewport configured to transmit plasma light generated in the chamber, a rotation module coupled to the viewport to be rotatable around a rotation axis, and an OES (Optical Emission Spectroscopy) device which is coupled to the rotation module and configured to receive the plasma light, wherein the rotation module includes a first surface facing the viewport and a second surface facing the OES device, wherein the first surface is configured to block a part of the plasma light, and includes a first opening through which an inside of the rotation module is configured to be exposed to a part of the plasma light, and wherein the second surface includes a second opening configured to be in light communication with the first opening.