公开(公告)号：US20130188306A1

公开(公告)日：2013-07-25

申请号：US13798553

申请日：2013-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-soo Park ,  Kyung-suk Kim

IPC: G06F1/16 ,  H05K1/18

CPC classification number: G06F1/16 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0949 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract translation: 公开了能够选择性地将不同类型的连接器应用于基板的装置。 存储装置包括具有控制器的基板。 第一和第二连接器焊盘可以布置在衬底的顶表面和底表面的边缘上。 通孔可以布置在控制器与第一和第二连接器焊盘之间。 第一无源器件焊盘可以布置在通孔和第一连接器焊盘之间。 第二无源器件焊盘可以布置在通孔和第二连接器焊盘之间。 无源器件可以仅耦合到第一无源器件焊盘或第二无源器件焊盘中的一个。

公开(公告)号：US09030836B2

公开(公告)日：2015-05-12

申请号：US13798553

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-soo Park ,  Kyung-suk Kim

IPC: H05K7/00 ,  G06F1/16 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0949 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract translation: 公开了能够选择性地将不同类型的连接器应用于基板的装置。 存储装置包括具有控制器的基板。 第一和第二连接器焊盘可以布置在衬底的顶表面和底表面的边缘上。 通孔可以布置在控制器和第一和第二连接器焊盘之间。 第一无源器件焊盘可以布置在通孔和第一连接器焊盘之间。 第二无源器件焊盘可以布置在通孔和第二连接器焊盘之间。 无源器件可以仅耦合到第一无源器件焊盘或第二无源器件焊盘中的一个。

公开(公告)号：US08654558B2

公开(公告)日：2014-02-18

申请号：US13762817

申请日：2013-02-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Kwang-soo Park

IPC: G11C5/06

CPC classification number: G11C5/06 ,  G11C5/025 ,  G11C5/04

Abstract: A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number.

Abstract translation: 具有改善的信号完整性的存储器系统包括用于存储器件的印刷电路板，安装在印刷电路板上的N个存储器半导体封装，安装在印刷电路板上的第一开关，安装在印刷电路板上的控制器，N 将所述半导体封装与所述第一开关连接的第一信号线，使得所述半导体封装和所述第一开关为N对1对应，将所述第一开关连接到所述控制器的第二信号线，以及连接所述半导体封装 到第一开关，使得半导体封装和第一开关处于N对1的对应关系。 N个选择线将半导体封装连接到控制器并发送使能信号。 N是自然数。