公开(公告)号：US20130188306A1

公开(公告)日：2013-07-25

申请号：US13798553

申请日：2013-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-soo Park ,  Kyung-suk Kim

IPC: G06F1/16 ,  H05K1/18

CPC classification number: G06F1/16 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0949 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract translation: 公开了能够选择性地将不同类型的连接器应用于基板的装置。 存储装置包括具有控制器的基板。 第一和第二连接器焊盘可以布置在衬底的顶表面和底表面的边缘上。 通孔可以布置在控制器与第一和第二连接器焊盘之间。 第一无源器件焊盘可以布置在通孔和第一连接器焊盘之间。 第二无源器件焊盘可以布置在通孔和第二连接器焊盘之间。 无源器件可以仅耦合到第一无源器件焊盘或第二无源器件焊盘中的一个。

公开(公告)号：US09030836B2

公开(公告)日：2015-05-12

申请号：US13798553

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-soo Park ,  Kyung-suk Kim

IPC: H05K7/00 ,  G06F1/16 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0949 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract translation: 公开了能够选择性地将不同类型的连接器应用于基板的装置。 存储装置包括具有控制器的基板。 第一和第二连接器焊盘可以布置在衬底的顶表面和底表面的边缘上。 通孔可以布置在控制器和第一和第二连接器焊盘之间。 第一无源器件焊盘可以布置在通孔和第一连接器焊盘之间。 第二无源器件焊盘可以布置在通孔和第二连接器焊盘之间。 无源器件可以仅耦合到第一无源器件焊盘或第二无源器件焊盘中的一个。