公开(公告)号：US20240412407A1

公开(公告)日：2024-12-12

申请号：US18437115

申请日：2024-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghee Cho ,  Yunje Cho ,  Kwangrak Kim ,  Jonghyeok Park

IPC: G06T7/73 ,  G06T7/00 ,  G06T7/246 ,  G06T7/60 ,  H01J37/09 ,  H01J37/10 ,  H01J37/153 ,  H01J37/22 ,  H01L21/68

Abstract: A semiconductor manufacturing device includes an electron beam source emitting; a plurality of condenser lenses disposed between a stage on which an object including structures is seated and the electron beam source; an objective lens disposed between the plurality of condenser lenses and the stage; an aperture disposed between the plurality of condenser lenses; and a controller configured to acquire a plurality of original images according to a working distance between the objective lens and the object, acquire a pattern image indicating the structures from the plurality of original images, a plurality of kernel images indicating distribution of an electron beam on the object, and a plurality of position vectors indicating a relative position of the structures in the plurality of kernel images, and adjust a position of the aperture based on a motion vector indicating movement of the plurality of position vectors according to the working distance.

公开(公告)号：US11946881B2

公开(公告)日：2024-04-02

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02 ,  G01R1/067 ,  H01L21/66

CPC classification number: G01N22/02 ,  H01L22/12

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US11320259B2

公开(公告)日：2022-05-03

申请号：US17185270

申请日：2021-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangrak Kim ,  Soonyang Kwon ,  Jangryul Park ,  Yunje Cho

IPC: G01B11/06 ,  H01L21/66 ,  G01B11/24 ,  H01L21/67

Abstract: A spectroscopic measuring apparatus and method are provided. The apparatus includes a first light source, object, microlens, and imaging lenses, an optical fiber, a spectrometer and a position controller. The object lens to allows light from the first light source to be incident on a stage configured to support a measurement object. The microlens is disposed between the object lens and the stage. The imaging lens images light reflected from the measurement object. The optical fiber has an input terminal disposed on a first image plane of the imaging lens. The spectrometer is disposed at an output terminal of the optical fiber. The position controller controls positions of the object lens, the microlens, and the optical fiber, and adjusts the position of the object lens so that a focus of the object lens is positioned at a virtual image position of a virtual image generated by the microlens.

公开(公告)号：US12205040B2

公开(公告)日：2025-01-21

申请号：US17245173

申请日：2021-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsung Bae ,  Seungho Gwak ,  Kwangrak Kim ,  Seunggun Byoun ,  Gilwoo Song ,  Younghoon Shin ,  Kyungwon Yun ,  Chiyoung Lee ,  Taeyong Jo

IPC: G06N3/088 ,  G06N3/042 ,  G06N3/045 ,  G06N3/067 ,  H01L21/66

Abstract: A method of manufacturing a semiconductor device includes forming a pattern on a wafer, measuring a spectrum of the pattern on the wafer, with a spectral optical system, performing an analysis of the spectrum through a deep learning model for predicting pattern characteristics, the deep learning model being trained based on a domain knowledge, and evaluating the pattern on the wafer based on the analysis of the spectrum, wherein the domain knowledge includes a noise inducing factor of the spectral optical system.

公开(公告)号：US20240060907A1

公开(公告)日：2024-02-22

申请号：US18340394

申请日：2023-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun Choi ,  Soonyang Kwon ,  Kwangrak Kim ,  Jiwoong Kim ,  Jangryul Park ,  Myungjun Lee

IPC: G01N21/95 ,  G01N21/31

CPC classification number: G01N21/9501 ,  G01N21/31 ,  G01N2201/068 ,  G02B21/248

Abstract: In a focus control method of a spectroscopic measuring apparatus, the spectroscopic measuring apparatus having a first objective lens and a second objective lens equipped with a microsphere is provided. A sample is placed on a stage. A spectrum is obtained while moving the second objective lens vertically downward. A light intensity function that changes with a distance from a sample surface is obtained from the spectrum. A focal position of the second objective lens is determined from a threshold value of the light intensity function.

公开(公告)号：US20220412898A1

公开(公告)日：2022-12-29

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.