公开(公告)号：US11862548B2

公开(公告)日：2024-01-02

申请号：US17340280

申请日：2021-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungsuk Yang ,  Soyoung Lim ,  Yechung Chung

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/538 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/481 ,  H01L21/486 ,  H01L22/14 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/4985 ,  H01L23/5387 ,  H01L25/18

Abstract: A package substrate film including a film substrate including upper and lower surfaces; a test pattern including an upper test line pattern extending on the upper surface of the film substrate; a lower test line pattern extending on the lower surface of the film substrate; a first test via pattern penetrating the film substrate and connecting the upper test line pattern to the lower test line pattern; a second test via pattern penetrating the film substrate outside the first test via pattern and connecting the upper test line pattern to the lower test line pattern; and a test pad between the first test via pattern and the second test via pattern, the test pad including first test pad at an outer side of the first test via pattern; and second test pad at an inner side of the second test via pattern and facing the first test pad.

公开(公告)号：US10282587B2

公开(公告)日：2019-05-07

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Choi ,  Youngdoo Jung ,  Woonbae Kim ,  Jungwoo Kim ,  Ji-Yong Park ,  Kyoungsuk Yang ,  Jeong-Kyu Ha

IPC: G06K9/20 ,  G06K9/00

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US09313889B2

公开(公告)日：2016-04-12

申请号：US14262658

申请日：2014-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungsuk Yang ,  Jeong-Kyu Ha ,  PaLan Lee ,  Narae Shin ,  Soyoung Lim ,  Jae-Min Jung ,  KyongSoon Cho

IPC: H05B33/00 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。