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公开(公告)号：US09158349B2
公开(公告)日：2015-10-13
申请号：US14135223
申请日：2013-12-19
Applicant: SanDisk Enterprise IP LLC
Inventor： David Dean , Robert Ellis
CPC classification number: G06F1/20 , G06F1/185 , G11C5/04 , H01L23/34 , H01L23/467 , H01L2924/0002 , H05K1/0209 , H05K3/366 , H05K13/00 , H05K2201/066 , H05K2201/10159 , Y10T29/49117 , H01L2924/00
Abstract: The various implementations described herein include systems, methods and/or devices used to manage heat flow for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one embodiment, heat sinks are disposed on front sides of a first module and a second module in the electronic system, and at least one heat sink in the second module is disposed between at least two heat sinks in the first module. In some embodiments, the number of heat sinks and/or a subset of geometric parameters for the locations, sizes and shapes of the heat sinks are configured for the purpose of disturbing and mixing air flow that passes an air gap between the front sides of the first and second modules.
Abstract translation: 本文描述的各种实现方式包括用于管理热流以消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 在一个实施例中，散热器设置在电子系统中的第一模块和第二模块的前侧，并且第二模块中的至少一个散热器设置在第一模块中的至少两个散热器之间。 在一些实施例中，用于散热器的位置，尺寸和形状的散热器的数量和/或几何参数的子集被配置为用于扰乱和混合通过气流的前侧之间的空气间隙的气流 第一和第二模块。
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公开(公告)号：US09519319B2
公开(公告)日：2016-12-13
申请号：US14244716
申请日：2014-04-03
Applicant: SanDisk Enterprise IP LLC
Inventor： David Dean , Robert W. Ellis
IPC: G01R31/20 , G06F1/20 , G01R31/28 , G01R1/04 , G01R31/26 , H01L23/467 , H05K1/14 , H05K7/20 , G01R31/00 , H01L23/498 , H05K1/02
CPC classification number: G06F1/20 , G01R1/0408 , G01R31/2601 , G01R31/2834 , G01R31/2887 , G01R31/2891 , H01L23/467 , H01L23/49833 , H01L23/4985 , H01L2924/0002 , H05K1/0201 , H05K1/147 , H05K7/20727 , H05K2201/042 , H01L2924/00
Abstract: Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.
Abstract translation: 本文描述的各种实施例包括用于耗散电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热量的系统，方法和/或设备。 一方面，电子组件包括第一电路板，柔性地联接到第一电路板的第二电路板，耦合到第二电路板的连接模块和紧固件。 紧固件被配置为将第一电路板耦合到连接模块，使得第一电路板和第二电路板基本上平行并且被空间隔开，其中空间形成通道的至少一部分，其被配置为引导 气流通过第一电路板，第二电路板和连接模块之间的空间。
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公开(公告)号：US20150264834A1
公开(公告)日：2015-09-17
申请号：US14244745
申请日：2014-04-03
Applicant: SanDisk Enterprise IP LLC
Inventor： Robert W. Ellis , David Dean
CPC classification number: H05K1/0203 , G06F1/187 , G06F1/203 , G11B33/142 , H05K1/144 , H05K7/1418 , H05K7/20136 , H05K7/20145
Abstract: Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel there between for receiving a heat dissipating airflow.
Abstract translation: 本文所述的各种实施方案公开了用于消散由电子组件的电子部件产生的热量的系统，方法和/或装置，其还包括第一组装轨道，顶部电路板和底部电路板。 第一组装轨道包括第一卡引导结构和第二卡引导结构，其布置在靠近组装轨的两个相对端的第一组装轨道的第一侧上。 顶部和底部电路板分别机械耦合到第一组装轨道的第一和第二卡引导结构。 顶部电路板平行于底部电路板，并与底部电路板隔开预定距离。 第一组装轨道，顶部电路板和底部电路板一起在其间形成用于接收散热气流的通道。
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公开(公告)号：US20150261266A1
公开(公告)日：2015-09-17
申请号：US14244734
申请日：2014-04-03
Applicant: SanDisk Enterprise IP LLC
Inventor： David Dean , Robert W. Ellis
IPC: G06F1/20
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 在一个方面，电子组件包括具有与其耦合的一个或多个发热部件的第一电路板。 电子组件还包括具有与其耦合的一个或多个热敏元件的第二电路板。 电子组件还包括热障互连。 热障互连将第一电路板电耦合到第二电路板。 在一些实施例中，热障互连是具有比第一电路板和第二电路板更低热导率的柔性互连。 热障互连在第一和第二电路板之间形成热障，其保护热敏部件免于发热部件。
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公开(公告)号：US20150245533A1
公开(公告)日：2015-08-27
申请号：US14275690
申请日：2014-05-12
Applicant: SanDisk Enterprise IP LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 一方面，电子系统包括基板，至少一个电子部件和散热器。 所述至少一个电子部件机械耦合到所述基板并且热耦合到所述基板的接地平面，使得由所述至少一个电子部件产生的热量至少部分地被耗散到所述基板的接地平面。 散热器机械耦合到衬底的边缘，并且热耦合到衬底的接地平面，以至少部分地耗散由至少一个电子部件产生的热量。 在一些实施例中，散热器还包括附接结构，突片和多个散热器。
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Patent Agency Ranking
6.发明授权公开(公告)号：US09549457B2
公开(公告)日：2017-01-17
申请号：US14179247
申请日：2014-02-12
Applicant: SanDisk Enterprise IP LLC
Inventor： Robert W. Ellis , David Dean
CPC classification number: H05K1/0203 , G06F1/20 , H01L23/467 , H01L2924/0002 , H05K1/0209 , H05K1/189 , H05K7/20127 , H05K7/20145 , H05K9/0079 , H05K2201/09063 , H01L2924/00
Abstract: The system for redirecting airflow includes multiple electronic assemblies arranged adjacent to one another. Each electronic assembly includes a substrate having a substantially flat first surface and an opposing substantially flat second surface. Electronic devices are coupled to each of the first and second surfaces. Each surface also has one or more tabs coupled thereto, where each tab is configured to redirect the airflow over a least one electronic device.
Abstract translation: 用于重定向气流的系统包括彼此相邻布置的多个电子组件。 每个电子组件包括具有基本上平坦的第一表面和相对的基本平坦的第二表面的基板。 电子设备耦合到第一和第二表面中的每一个。 每个表面还具有连接到其上的一个或多个突片，其中每个突出部配置成将气流重定向在至少一个电子设备上。
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公开(公告)号：US20150261265A1
公开(公告)日：2015-09-17
申请号：US14244716
申请日：2014-04-03
Applicant: SanDisk Enterprise IP LLC
Inventor： David Dean , Robert W. Ellis
CPC classification number: G06F1/20 , G01R1/0408 , G01R31/2601 , G01R31/2834 , G01R31/2887 , G01R31/2891 , H01L23/467 , H01L23/49833 , H01L23/4985 , H01L2924/0002 , H05K1/0201 , H05K1/147 , H05K7/20727 , H05K2201/042 , H01L2924/00
Abstract: Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.
Abstract translation: 本文描述的各种实施例包括用于耗散电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热量的系统，方法和/或设备。 一方面，电子组件包括第一电路板，柔性地联接到第一电路板的第二电路板，耦合到第二电路板的连接模块和紧固件。 紧固件被配置为将第一电路板耦合到连接模块，使得第一电路板和第二电路板基本上平行并且被空间隔开，其中空间形成通道的至少一部分，其被配置为引导 气流通过第一电路板，第二电路板和连接模块之间的空间。
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公开(公告)号：US20150098176A1
公开(公告)日：2015-04-09
申请号：US14135223
申请日：2013-12-19
Applicant: SanDisk Enterprise IP LLC
Inventor： David Dean , Robert Ellis
CPC classification number: G06F1/20 , G06F1/185 , G11C5/04 , H01L23/34 , H01L23/467 , H01L2924/0002 , H05K1/0209 , H05K3/366 , H05K13/00 , H05K2201/066 , H05K2201/10159 , Y10T29/49117 , H01L2924/00
Abstract: The various implementations described herein include systems, methods and/or devices used to manage heat flow for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one embodiment, heat sinks are disposed on front sides of a first module and a second module in the electronic system, and at least one heat sink in the second module is disposed between at least two heat sinks in the first module. In some embodiments, the number of heat sinks and/or a subset of geometric parameters for the locations, sizes and shapes of the heat sinks are configured for the purpose of disturbing and mixing air flow that passes an air gap between the front sides of the first and second modules.
Abstract translation: 本文描述的各种实现方式包括用于管理热流以消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 在一个实施例中，散热器设置在电子系统中的第一模块和第二模块的前侧，并且第二模块中的至少一个散热器设置在第一模块中的至少两个散热器之间。 在一些实施例中，用于散热器的位置，尺寸和形状的散热器的数量和/或几何参数的子集被配置为用于扰乱和混合通过气流的前侧之间的空气间隙的气流 第一和第二模块。
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公开(公告)号：US09497889B2
公开(公告)日：2016-11-15
申请号：US14275690
申请日：2014-05-12
Applicant: SanDisk Enterprise IP LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 一方面，电子系统包括基板，至少一个电子部件和散热器。 所述至少一个电子部件机械耦合到所述基板并且热耦合到所述基板的接地平面，使得由所述至少一个电子部件产生的热量至少部分地被耗散到所述基板的接地平面。 散热器机械耦合到衬底的边缘，并且热耦合到衬底的接地平面，以至少部分地耗散由至少一个电子部件产生的热量。 在一些实施例中，散热器还包括附接结构，突片和多个散热器。
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公开(公告)号：US09485851B2
公开(公告)日：2016-11-01
申请号：US14244745
申请日：2014-04-03
Applicant: SanDisk Enterprise IP LLC
Inventor： Robert W. Ellis , David Dean
CPC classification number: H05K1/0203 , G06F1/187 , G06F1/203 , G11B33/142 , H05K1/144 , H05K7/1418 , H05K7/20136 , H05K7/20145
Abstract: Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel there between for receiving a heat dissipating airflow.
Abstract translation: 本文所述的各种实施方案公开了用于消散由电子组件的电子部件产生的热量的系统，方法和/或装置，其还包括第一组装轨道，顶部电路板和底部电路板。 第一组装轨道包括第一卡引导结构和第二卡引导结构，其布置在靠近组装轨的两个相对端的第一组装轨道的第一侧上。 顶部和底部电路板分别机械耦合到第一组装轨道的第一和第二卡引导结构。 顶部电路板平行于底部电路板，并与底部电路板隔开预定距离。 第一组装轨道，顶部电路板和底部电路板一起在其间形成用于接收散热气流的通道。
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