公开(公告)号：US20150116971A1

公开(公告)日：2015-04-30

申请号：US14519327

申请日：2014-10-21

Applicant: Seiko Instruments Inc.

Inventor： Atsushi KOZUKI ,  Hideshi HAMADA ,  Yoshifumi YOSHIDA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K3/247 ,  H01L2224/16225 ,  H01L2924/16152 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract translation: 本发明的电子设备包括：绝缘基底，其中形成有多个通孔，电连接到贯通电极并安装在基底基片的一个表面上的电子元件，容纳电子元件的盖子 并且结合到基底基板的一个表面，并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成，并由锡或锡合金形成。

公开(公告)号：US20150116969A1

公开(公告)日：2015-04-30

申请号：US14519331

申请日：2014-10-21

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Atsushi KOZUKI ,  Hideshi HAMADA ,  Yoshifumi YOSHIDA

IPC: H05K1/09 ,  H05K3/30 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/09 ,  B81B7/007 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/108 ,  H05K3/4007 ,  H05K3/4046 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method. The second electrolytic plating film is formed of tin or a tin alloy.

Abstract translation: 本发明的电子器件包括：绝缘基底，其中形成有多个通孔; 电连接到贯通电极并安装在基底基板的一个表面上的电子元件; 容纳所述电子元件并且与所述基底基板的一个表面接合的盖子; 以及外部电极，其覆盖从由所述基底基板的另一个表面露出的所述贯通电极的端面的区域到所述端面附近的另一个表面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，通过电解电镀法形成在导电膜的表面上的第一电解电镀膜，以及 通过电解电镀法形成在第一电解镀膜的表面上的第二电解镀膜。 第二电解镀膜由锡或锡合金形成。