公开(公告)号：US20210282650A1

公开(公告)日：2021-09-16

申请号：US17194937

申请日：2021-03-08

Applicant: SEIKO INSTRUMENTS INC. ,  Science Energy CO., LTD.

Inventor： Yoshifumi YOSHIDA ,  Kotaro MAKI

IPC: A61B5/0205 ,  H04Q9/00 ,  A61B5/00 ,  A61B5/117 ,  A61B5/024 ,  A61B5/026 ,  A61B5/1455

Abstract: The present intraoral sensing system which is configured to sense a biological information using a sensor module installed in an oral cavity, including: a sensor module installed in an oral cavity of a patient and configured to store data acquired when the biological information is sensed; a storage configured to acquire the data and an identification information of the patient stored by the sensor module, associate the acquired data with the identification information of the patient, and store the association; a terminal apparatus for a dentist configured to analyze the data stored in the storage for each of the identification information of the patient; and a terminal apparatus for a doctor configured to acquire the data associated with a patient who has a developed disease among the data of patients stored in the storage, from the terminal apparatus for a dentist.

公开(公告)号：US20150116971A1

公开(公告)日：2015-04-30

申请号：US14519327

申请日：2014-10-21

Applicant: Seiko Instruments Inc.

Inventor： Atsushi KOZUKI ,  Hideshi HAMADA ,  Yoshifumi YOSHIDA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K3/247 ,  H01L2224/16225 ,  H01L2924/16152 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract translation: 本发明的电子设备包括：绝缘基底，其中形成有多个通孔，电连接到贯通电极并安装在基底基片的一个表面上的电子元件，容纳电子元件的盖子 并且结合到基底基板的一个表面，并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成，并由锡或锡合金形成。

公开(公告)号：US20150116969A1

公开(公告)日：2015-04-30

申请号：US14519331

申请日：2014-10-21

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Atsushi KOZUKI ,  Hideshi HAMADA ,  Yoshifumi YOSHIDA

IPC: H05K1/09 ,  H05K3/30 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/09 ,  B81B7/007 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/108 ,  H05K3/4007 ,  H05K3/4046 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method. The second electrolytic plating film is formed of tin or a tin alloy.

Abstract translation: 本发明的电子器件包括：绝缘基底，其中形成有多个通孔; 电连接到贯通电极并安装在基底基板的一个表面上的电子元件; 容纳所述电子元件并且与所述基底基板的一个表面接合的盖子; 以及外部电极，其覆盖从由所述基底基板的另一个表面露出的所述贯通电极的端面的区域到所述端面附近的另一个表面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，通过电解电镀法形成在导电膜的表面上的第一电解电镀膜，以及 通过电解电镀法形成在第一电解镀膜的表面上的第二电解镀膜。 第二电解镀膜由锡或锡合金形成。

公开(公告)号：US20130207735A1

公开(公告)日：2013-08-15

申请号：US13761842

申请日：2013-02-07

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Yoshifumi YOSHIDA

IPC: H01L41/047 ,  H03B5/32 ,  H01L41/053

CPC classification number: H01L41/0472 ,  H01L41/053 ,  H03B5/32 ,  H03H9/1021 ,  H03H9/17

Abstract: The vibrating device of the invention includes a base member, a lid member joined the base member to constitute a cavity, and a vibrating strip housed in the cavity. The vibrating strip includes a thick center portion and a thin outer peripheral portion, the center portion includes an exciting electrode exciting vibration, and the outer peripheral portion includes terminal electrode electrically connected to exciting electrode and having a thickness larger than that of the exciting electrode. The base member is provided with a connecting portion on the surface thereof, and the connecting portion is connected to the terminal electrode and holds the vibrating strip in a cantilevered manner. Accordingly, the vibrating strip is supported by a very small bonding surface, and a compact vibrating device subjected to little deterioration in frequency characteristics with respect to the temperature change is realized.

Abstract translation: 本发明的振动装置包括基部构件，连接到基部构件以构成空腔的盖构件和容纳在空腔中的振动条。 振动片包括厚中心部分和薄外周部分，中心部分包​​括激发电极激励振动，外周部分包括电连接到激励电极并且具有比激励电极的厚度大的厚度的端电极。 基座部件在其表面上设置有连接部分，连接部分与端子电极连接并以悬臂方式保持振动条。 因此，振动带由非常小的接合面支撑，并且实现了相对于温度变化几乎没有频率特性劣化的紧凑振动装置。

公开(公告)号：US20130193806A1

公开(公告)日：2013-08-01

申请号：US13660481

申请日：2012-10-25

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Yoshifumi YOSHIDA

IPC: H01L41/053

CPC classification number: H03H9/0519 ,  H03H9/1021

Abstract: A vibration device according to an embodiment of the present invention includes a base, a lid body bonded to the base to form a cavity and a vibrating reed housed in the cavity. The vibrating reed includes a main body and an extended portion extending in a short side direction of the main body, and in the vibrating reed, the extended portion is supported by a first connection portion arranged on the base and the main body is supported by a second connection portion in a cantilever manner. Accordingly, when ambient temperature changes and a stress is applied between the first and second connection portions, the stress is alleviated by the extended portion.

Abstract translation: 根据本发明的实施例的振动装置包括基座，结合到基座以形成空腔的盖体和容纳在空腔中的振动筘。 振动片包括主体和沿主体的短边方向延伸的延伸部分，并且在振动片中，延伸部分由布置在基部上的第一连接部分支撑，主体由一个 第二连接部分以悬臂方式。 因此，当环境温度变化并且在第一和第二连接部分之间施加应力时，应力由延伸部分减轻。