ACTIVE MATRIX SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE

    公开(公告)号:US20230244114A1

    公开(公告)日:2023-08-03

    申请号:US18095821

    申请日:2023-01-11

    CPC classification number: G02F1/136286 G02F1/1368 H01L27/1225 H01L27/124

    Abstract: An active matrix substrate includes, in each pixel region, a pixel TFT of an oxide semiconductor layer having source and drain regions, a first insulating layer disposed on top of the oxide semiconductor layer, an extraction electrode, disposed on top of the first insulating layer, that includes a transparent conductive film, and a pixel electrode connected to the extraction electrode. The first insulating layer includes first and second contact holes located above the source and drain regions, respectively. Part of a source bus line overlaps part of the source region and is connected to the source region via the first contact hole. The extraction electrode is connected to the drain region via the second contact hole. Shapes of bottoms of the first and second contact holes are different from each other, and the shape of the bottom of the second contact hole includes two orthogonal sides.

    TRANSISTOR AND MANUFACTURING METHOD FOR TRANSISTOR

    公开(公告)号:US20250116906A1

    公开(公告)日:2025-04-10

    申请号:US18883192

    申请日:2024-09-12

    Abstract: A transistor includes a semiconductor portion extending in a first direction, a first electrode extending in a second direction intersecting the first direction and is disposed overlapping a portion of the semiconductor portion, a first insulating film that is interposed between the first electrode and the semiconductor portion, a second electrode that is connected to the semiconductor portion, and a third electrode that is connected to the semiconductor portion, in which the first insulating film includes a first thick portion and a second thick portion having a film thickness greater than that of the first thick portion, at least two of the first thick portions are disposed at intervals in the second direction at positions overlapping both the first electrode and the semiconductor portion, and the second thick portion is disposed to be interposed between the two first thick portions in the second direction at a position overlapping both the first electrode and the semiconductor portion.

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