公开(公告)号：US20220336256A1

公开(公告)日：2022-10-20

申请号：US17642951

申请日：2021-04-16

Applicant: SHINKAWA LTD.

Inventor： Makoto TAKAHASHI

IPC: H01L21/683 ,  B25J15/06 ,  B65G47/91

Abstract: This semiconductor device manufacturing device comprises: a stage; a bonding head; a copying mechanism provided on the bonding head; and a controller that executes the copying process to adjust a facing surface to be parallel to a reference plane by having the facing surface, which is a holding surface or a chip end face, follow the reference plane 110, which is a planar surface of the stage or a substrate. In the copying process, the controller moves the bonding head relative to the surface direction of the reference plane with the facing surface left abutting the reference plane in a state with the copying mechanism switched to a free state, until the axial direction position of the bonding head reaches a stipulated reference position, and when the axial direction position reaches the reference position, switches the copying mechanism to a locked state.

公开(公告)号：US20230268313A1

公开(公告)日：2023-08-24

申请号：US18024268

申请日：2020-09-02

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Makoto TAKAHASHI

IPC: H01L23/00 ,  B23K1/00 ,  B23K37/04

CPC classification number: H01L24/75 ,  H01L24/81 ,  B23K1/0016 ,  B23K37/0408 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/75745 ,  H01L2224/8118 ,  H01L2224/81203 ,  B23K2101/40

Abstract: A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to the chip that is grounded. The controller causes the two bonding heads to perform the positioning process and the grounding process independently from each other in a non-pressurizing period in which neither of the bonding heads is performing the pressurizing process, and causes the two bonding heads after completing the positioning process and the grounding process to perform the pressurizing process in parallel.

公开(公告)号：US20220359240A1

公开(公告)日：2022-11-10

申请号：US17626810

申请日：2020-08-07

Applicant: SHINKAWA LTD.

Inventor： Makoto TAKAHASHI

IPC: H01L21/67 ,  H01L21/60

Abstract: A manufacturing apparatus of a semiconductor device includes: a stage; a bonding head, including a mounting tool, a tool heater, and a lifting and lowering mechanism; and a controller performing bonding processing. The controller performs, in the bonding processing: first processing in which, after a chip is brought into contact with a substrate, as heating of the chip is started, the chip is pressurized against the substrate; distortion elimination processing in which, after the first processing and before melting of a bump, the lifting and lowering mechanism is driven in a lifting direction, thereby eliminating distortion of the bonding head; and second processing in which, after the distortion elimination processing, position control is performed on the lifting and lowering mechanism so as to cancel thermal expansion and contraction of the bonding head, thereby maintaining a gap amount at a specified target value.

公开(公告)号：US20220223450A1

公开(公告)日：2022-07-14

申请号：US17609401

申请日：2020-11-10

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Makoto TAKAHASHI

IPC: H01L21/68 ,  H01L23/00

Abstract: An apparatus (10) for producing a semiconductor device comprises a stage (16), a bonding head (14), a bonding tool (24) and a first camera (26) that are attached to the bonding head (14), and a controller (18), the apparatus (10) moreover being such that the controller (18) is configured to execute for each of one or more points: a process of mounting an inspection chip (130) on a mounting surface; a process of acquiring, as an inspection image (44), an image of the mounting surface after the inspection chip (130) has been mounted thereon captured by the first camera (26); a process of calculating, as an area correction amount C, a correction amount for a camera offset amount Ocm on the basis of the position of the inspection chip (130) in the inspection image (44); and a process of associating the calculated area correction amount C and the position of a discretionary point and then storing the associated information in a storage device.

公开(公告)号：US20160029494A1

公开(公告)日：2016-01-28

申请号：US14871622

申请日：2015-09-30

Applicant: Shinkawa Ltd.

Inventor： Koji HOJO ,  Makoto TAKAHASHI

IPC: H05K3/34

CPC classification number: H05K3/3494 ,  H01L21/67011 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1601 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75305 ,  H01L2224/75502 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75901 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12043 ,  H05K3/3436 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.

公开(公告)号：US20220199448A1

公开(公告)日：2022-06-23

申请号：US17603943

申请日：2020-04-14

Applicant: SHINKAWA LTD.

Inventor： Makoto TAKAHASHI ,  Tomonori NAKAMURA

IPC: H01L21/68 ,  H01L21/67 ,  G06T7/73 ,  G06T7/00 ,  B25J9/16 ,  B25J13/08

Abstract: A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a reference position of the position detection camera; and actual position correction of detecting the actual bonding position of a semiconductor element after bonding using the position detection camera at every timing when the cumulative value of the amounts of correction of the mark correction from the previous actual position correction exceeds a prescribed first threshold and correcting the amount of movement of the bonding head on the basis of the amount of positional deviation between the detected actual bonding position and a target bonding position.

公开(公告)号：US20240404890A1

公开(公告)日：2024-12-05

申请号：US18271845

申请日：2022-02-15

Applicant: SHINKAWA LTD.

Inventor： Makoto TAKAHASHI

IPC: H01L21/66 ,  H01L21/68

Abstract: An inspection device includes: a measurement part, measuring a reference position of a mounting section before mounting of a semiconductor chip, a reference position of a plurality of peripheral sections located around the mounting section, and a position of the semiconductor chip after mounting; and an inspection part, inspecting a relative position of the semiconductor chip with respect to the mounting section based on a distance between the reference position of the mounting section and the reference position of the plurality of peripheral sections measured by the measurement part and a distance between the reference position of the plurality of peripheral sections and a mounting position of the semiconductor chip after mounting of the semiconductor chip.