公开(公告)号：US20150037499A1

公开(公告)日：2015-02-05

申请号：US14445736

申请日：2014-07-29

Applicant: Solid State Equipment LLC

Inventor： William Gilbert Breingan ,  James K. Anders ,  Herman Itzkowitz

IPC: H01L21/683 ,  B05C11/08 ,  B05C13/00 ,  B05D1/00

CPC classification number: B05C13/00 ,  B05C1/08 ,  B05D1/005 ,  C23C14/505 ,  C23C16/4585 ,  C23C16/4588 ,  H01L21/6838 ,  H01L21/68792

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer,

Abstract translation: 提供了根据本发明的旋转卡盘，并且被配置为消除化学品在晶片边缘上的包裹。 双速晶片旋转卡盘装置用于防止液体在加工期间影响晶片的背面。 在晶片周围放置一个外环，其间具有窄的间隙，使得当晶片表面移动到晶片的最外边缘时，晶片表面上的液滴将接触外环。 通过高速旋转该外圈，离心力使这些液滴从晶片上拉出并径向向外排出，从而防止液体影响晶片的背面，