公开(公告)号：US07241340B2

公开(公告)日：2007-07-10

申请号：US10627530

申请日：2003-07-24

Applicant: Stuart K. Janikowski ,  Mark D. Argyle ,  Robert V. Fox ,  W. Alan Propp ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

Inventor： Stuart K. Janikowski ,  Mark D. Argyle ,  Robert V. Fox ,  W. Alan Propp ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

IPC: B05C11/00

CPC classification number: D06M23/105 ,  B05D1/18 ,  B05D7/20 ,  B05D2252/02 ,  B05D2252/10 ,  B05D2401/90 ,  C03C25/12 ,  C03C25/22

Abstract: The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

Abstract translation: 本发明涉及用修饰剂修饰各种非等维底物的系统和方法。 该系统包括被配置用于使非等量基底通过其中的处理室，其中处理室还被配置成在非等量基底通过处理室运动期间接受处理混合物进入腔室。 处理混合物可以在载体介质中包含改性剂，其中载体介质选自超临界流体，近临界流体，过热流体，过热液体和液化气体。 因此，在处理混合物和非等尺寸底物之间接触时，改性剂可以施加到非等维基底上。

公开(公告)号：US6150580A

公开(公告)日：2000-11-21

申请号：US969613

申请日：1997-11-13

Applicant: Stuart K. Janikowski

Inventor： Stuart K. Janikowski

IPC: A62D3/00 ,  A62D3/20 ,  A62D3/34 ,  A62D3/35 ,  A62D3/38 ,  A62D101/04 ,  A62D101/20 ,  A62D101/22 ,  A62D101/24 ,  A62D101/26 ,  A62D101/28 ,  A62D101/40 ,  A62D101/43 ,  A62D101/45 ,  A62D101/47 ,  B01J3/08 ,  B01J19/00 ,  B01J19/18

CPC classification number: A62D3/20 ,  B01J19/18 ,  B01J3/08 ,  A62D2101/04 ,  A62D2101/20 ,  A62D2203/10

Abstract: A waste destruction method using a reactor vessel to combust and destroy organic and combustible waste, including the steps of introducing a supply of waste into the reactor vessel, introducing a supply of an oxidant into the reactor vessel to mix with the waste forming a waste and oxidant mixture, introducing a supply of water into the reactor vessel to mix with the waste and oxidant mixture forming a waste, water and oxidant mixture, reciprocatingly compressing the waste, water and oxidant mixture forming a compressed mixture, igniting the compressed mixture forming a exhaust gas, and venting the exhaust gas into the surrounding atmosphere.

Abstract translation: 使用反应堆容器燃烧和破坏有机和可燃废物的废物破坏方法，包括将废物供应引入反应堆容器的步骤，将氧化剂供应物引入反应器容器中以与形成废物的废物混合， 氧化剂混合物，将水供应到反应器容器中以与形成废物，水和氧化剂混合物的废物和氧化剂混合物混合，往复地压缩形成压缩混合物的废物，水和氧化剂混合物，点燃形成排气的压缩混合物 将废气排放到周围的大气中。

公开(公告)号：US06962731B2

公开(公告)日：2005-11-08

申请号：US10669662

申请日：2003-09-23

Applicant: W. Alan Propp ,  Mark D. Argyle ,  Stuart K. Janikowski ,  Robert V. Fox ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

Inventor： W. Alan Propp ,  Mark D. Argyle ,  Stuart K. Janikowski ,  Robert V. Fox ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

IPC: B05D1/02 ,  B05D7/00 ,  C03C25/12 ,  D06B3/04 ,  D06B23/16 ,  B05D1/18 ,  C23C16/00

CPC classification number: D06B3/045 ,  B05D1/025 ,  B05D7/52 ,  B05D2256/00 ,  B05D2401/90 ,  C03C25/12 ,  D06B23/16

Abstract: The present invention is related to the modifying of substrates with multiple modifying agents in a single continuous system. At least two processing chambers are configured for modifying the substrate in a continuous feed system. The processing chambers can be substantially isolated from one another by interstitial seals. Additionally, the two processing chambers can be substantially isolated from the surrounding atmosphere by end seals. Optionally, expansion chambers can be used to separate the seals from the processing chambers.

Abstract translation: 本发明涉及在单一连续系统中用多种改性剂改性底物。 至少两个处理室被配置用于在连续进料系统中修改基材。 处理室可以通过间隙密封基本上彼此隔离。 此外，两个处理室可以通过端部密封基本上与周围的大气隔离。 可选地，膨胀室可用于将密封件与处理室分离。

公开(公告)号：US06652654B1

公开(公告)日：2003-11-25

申请号：US09671459

申请日：2000-09-27

Applicant: W. Alan Propp ,  Mark D. Argyle ,  Stuart K. Janikowski ,  Robert V. Fox ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

Inventor： W. Alan Propp ,  Mark D. Argyle ,  Stuart K. Janikowski ,  Robert V. Fox ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  David L. Miller

IPC: C23C1600

CPC classification number: D06B3/045 ,  B05D1/025 ,  B05D7/52 ,  B05D2256/00 ,  B05D2401/90 ,  C03C25/12 ,  D06B23/16

Abstract: The present invention is related to the modifying of substrates with multiple modifying agents in a single continuous system. At least two processing chambers are configured for modifying the substrate in a continuous feed system. The processing chambers can be substantially isolated from one another by interstitial seals. Additionally, the two processing chambers can be substantially isolated from the surrounding atmosphere by end seals. Optionally, expansion chambers can be used to separate the seals from the processing chambers.

Abstract translation: 本发明涉及在单一连续系统中用多种改性剂改性底物。 至少两个处理室被配置用于在连续进料系统中修改基材。 处理室可以通过间隙密封基本上彼此隔离。 此外，两个处理室可以通过端部密封基本上与周围的大气隔离。 可选地，膨胀室可用于将密封件与处理室分离。

公开(公告)号：US06495204B1

公开(公告)日：2002-12-17

申请号：US09671709

申请日：2000-09-27

Applicant: Charles A. Allen ,  Mark D. Argyle ,  Robert V. Fox ,  Daniel M. Ginosar ,  Stuart K. Janikowski ,  David L. Miller ,  W. Alan Propp ,  William J. Toth

Inventor： Charles A. Allen ,  Mark D. Argyle ,  Robert V. Fox ,  Daniel M. Ginosar ,  Stuart K. Janikowski ,  David L. Miller ,  W. Alan Propp ,  William J. Toth

IPC: B05D700

CPC classification number: D02J1/00 ,  B05D7/20 ,  B05D2401/90 ,  C03C25/22

Abstract: The present invention is related to the modifying of substrates such as monofilaments, bundles of monofilaments, and fibrous structural material with a modifying agent. The modifying agent is suspended or dissolved in a supercritical fluid, near-critical fluid, superheated fluid, superheated liquid, or a liquified gas and is deposited by rapidly altering the pressure in a chamber to deposit the modifying material onto the substrate.

Abstract translation: 本发明涉及使用改性剂改性诸如单丝，单丝束和纤维结构材料的基底。 改性剂悬浮或溶解在超临界流体，临界临界流体，过热流体，过热液体或液化气体中，并通过快速改变腔室中的压力沉积到沉积改性材料到基底上而沉积。

公开(公告)号：US06623686B1

公开(公告)日：2003-09-23

申请号：US09677336

申请日：2000-09-28

Applicant: Stuart K. Janikowski ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  Mark D. Argyle ,  Robert V. Fox ,  W. Alan Propp ,  David L. Miller

Inventor： Stuart K. Janikowski ,  William J. Toth ,  Daniel M. Ginosar ,  Charles A. Allen ,  Mark D. Argyle ,  Robert V. Fox ,  W. Alan Propp ,  David L. Miller

IPC: B05D500

CPC classification number: D06M23/105 ,  B05D1/18 ,  B05D7/20 ,  B05D2252/02 ,  B05D2252/10 ,  B05D2401/90 ,  C03C25/12 ,  C03C25/22

Abstract: The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

Abstract translation: 本发明涉及用修饰剂修饰各种非等维底物的系统和方法。 该系统包括被配置用于使非等距衬底通过其中的处理腔室，其中处理室还被配置成在非等量衬底通过处理室运动期间接受处理混合物进入腔室。 处理混合物可以在载体介质中包含改性剂，其中载体介质选自超临界流体，近临界流体，过热流体，过热液体和液化气体。 因此，在处理混合物和非等尺寸底物之间接触时，改性剂可以施加到非等维基底上。

公开(公告)号：US06984768B2

公开(公告)日：2006-01-10

申请号：US10152599

申请日：2002-05-21

Applicant: Daniel M. Ginosar ,  Robert V. Fox ,  Stuart K. Janikowski

Inventor： Daniel M. Ginosar ,  Robert V. Fox ,  Stuart K. Janikowski

IPC: A62D3/00

CPC classification number: A62D3/34 ,  A62D3/37 ,  A62D2101/22

Abstract: A method for destroying halocarbons. Halocarbon materials are reacted in a dehalogenation process wherein they are combined with a solvent in the presence of a catalyst. A hydrogen-containing solvent is preferred which functions as both a solvating agent and hydrogen donor. To augment the hydrogen donation capacity of the solvent if needed (or when non-hydrogen-containing solvents are used), a supplemental hydrogen donor composition may be employed. In operation, at least one of the temperature and pressure of the solvent is maintained near, at, or above a critical level. For example, the solvent may be in (1) a supercritical state; (2) a state where one of the temperature or pressure thereof is at or above critical; or (3) a state where at least one of the temperature and pressure thereof is near-critical. This system provides numerous benefits including improved reaction rates, efficiency, and versatility.

Abstract translation: 一种破坏卤代烃的方法。 卤代烃材料在脱卤方法中反应，其中它们在催化剂存在下与溶剂组合。 优选含氢溶剂，其既用作溶剂化剂又可用作氢供体。 为了增加溶剂的氢气供应能力（如果需要的话）（或者当使用不含氢的溶剂时），可以使用补氢供体组合物。 在操作中，溶剂的温度和压力中的至少一个保持接近，等于或高于临界水平。 例如，溶剂可以是（1）超临界状态; （2）其温度或压力之一处于或超过临界状态; 或（3）至少其中一个温度和压力接近临界的状态。 该系统提供了许多好处，包括提高反应速率，效率和多功能性。

公开(公告)号：USH1136H

公开(公告)日：1993-02-02

申请号：US800291

申请日：1991-11-29

Applicant: Stuart K. Janikowski

Inventor： Stuart K. Janikowski

IPC: C25D3/46

CPC classification number: C25D3/46

Abstract: A method for electroplating sliver is described which comprises a plating and/or stripping solution of an alkali hydroxide and ethylenediamine having a basic pH in the range of about 7.5 to 13, and having an ethylenediamine concentration of about 5 to 33% by volume, the electroplating (at the cathode) and/or stripping (at the anode) being performed with an applied DC potential across the electrodes of about 2 to 6 volts.