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公开(公告)号:US20190304690A1
公开(公告)日:2019-10-03
申请号:US16367937
申请日:2019-03-28
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.
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公开(公告)号:US20190164694A1
公开(公告)日:2019-05-30
申请号:US16162580
申请日:2018-10-17
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.
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公开(公告)号:US20180211783A1
公开(公告)日:2018-07-26
申请号:US15819674
申请日:2017-11-21
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.
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公开(公告)号:US20190304689A1
公开(公告)日:2019-10-03
申请号:US16353747
申请日:2019-03-14
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.
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公开(公告)号:US20180211784A1
公开(公告)日:2018-07-26
申请号:US15819804
申请日:2017-11-21
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.
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公开(公告)号:US20180197681A1
公开(公告)日:2018-07-12
申请号:US15819778
申请日:2017-11-21
Applicant: TDK Corporation
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.
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公开(公告)号:US20180075973A1
公开(公告)日:2018-03-15
申请号:US15702047
申请日:2017-09-12
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.
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公开(公告)号:US20190304691A1
公开(公告)日:2019-10-03
申请号:US16369813
申请日:2019-03-29
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.
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公开(公告)号:US20190206626A1
公开(公告)日:2019-07-04
申请号:US16197870
申请日:2018-11-21
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.
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公开(公告)号:US20190080842A1
公开(公告)日:2019-03-14
申请号:US16121701
申请日:2018-09-05
Applicant: TDK CORPORATION
Inventor: Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.
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