公开(公告)号：US20230032681A1

公开(公告)日：2023-02-02

申请号：US17873985

申请日：2022-07-26

Applicant: TDK CORPORATION

Inventor： Junichiro URABE ,  Hajime KATO ,  Toshinori MATSUURA ,  Kenichi INOUE ,  Koutarou WATANABE

IPC: H01F27/02 ,  H01F27/34 ,  H01F27/28

Abstract: A coil component includes: a base having a pair of side wall portions separated from and facing each other and a connecting wall portion interconnecting the pair of side wall portions; and an air core coil formed by winding a wire, in which the air core coil is disposed in a groove portion formed by the pair of side wall portions and the connecting wall portion.

公开(公告)号：US20190080841A1

公开(公告)日：2019-03-14

申请号：US16121719

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Kenichi INOUE ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G2/06 ,  H01G4/01 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/38 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01G4/01 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/38 ,  H05K3/341 ,  H05K2201/10431

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.