公开(公告)号：US20240431027A1

公开(公告)日：2024-12-26

申请号：US18824153

申请日：2024-09-04

Applicant: TOPPAN HOLDINGS INC.

Inventor： Yuki UMEMURA

IPC: H05K1/11 ,  C03C15/00 ,  C03C23/00 ,  H05K1/03 ,  H05K3/40

Abstract: A glass substrate includes a through hole that penetrates the glass substrate from a first surface to a second surface. The through hole has a minimum bore diameter in the through hole in a section of 1% to 10% from the first surface in a section from the first surface to the second surface.

公开(公告)号：US20240224426A1

公开(公告)日：2024-07-04

申请号：US18604992

申请日：2024-03-14

Applicant: TOPPAN HOLDINGS INC.

Inventor： Yuki UMEMURA ,  Takehisa TAKADA ,  Tomoyuki ISHII

IPC: H05K1/16 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/162 ,  H05K1/0306 ,  H05K1/115 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827

Abstract: A component (capacitor) of the high-frequency circuit provided on a first surface of the glass substrate, and the bottom of the through hole in the glass substrate on the first surface have an overlapping part on the first surface. As a result, the capacitor is formed directly above the via, that is, the through hole, thereby eliminating the need for conductive wiring from the via to the capacitor. In addition, by forming a capacitor on a very flat glass substrate before forming the through hole, and forming the through hole after that, it is possible to stably form the capacitor.