SEMICONDUCTOR MEMORY DEVICE
    2.
    发明申请

    公开(公告)号:US20190288468A1

    公开(公告)日:2019-09-19

    申请号:US16125999

    申请日:2018-09-10

    Abstract: According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.

    USB DEVICE
    3.
    发明申请
    USB DEVICE 审中-公开

    公开(公告)号:US20180276521A1

    公开(公告)日:2018-09-27

    申请号:US15701535

    申请日:2017-09-12

    Abstract: According to one embodiment, a USB device includes a USB connector, a casing, and a holding member. The casing is provided with an opening. The holding member includes a holder, a support, and a first extension. The holder holds the USB connector. The support extends from the holder. The first extension has a protrusion, extends from the support, and is bendable. The protrusion is housed in the opening.

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