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    LIGHTING APPARATUS HAVING IMPROVED LIGHT OUTPUT UNIFORMITY AND THERMAL DISSIPATION
    2.
    发明申请
    LIGHTING APPARATUS HAVING IMPROVED LIGHT OUTPUT UNIFORMITY AND THERMAL DISSIPATION 有权
    具有改进的光输出均匀性和热释放的照明装置

    公开(公告)号：US20150124448A1

    公开(公告)日：2015-05-07

    申请号：US14598282

    申请日：2015-01-16

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Pei-Wen Ko ,  Wei-Yu Yeh

    IPC: F21K99/00 ,  F21V13/02 ,  F21V29/70

    CPC classification number: F21K9/54 ,  F21K9/62 ,  F21S6/00 ,  F21V13/02 ,  F21V17/12 ,  F21V29/50 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10

    Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.

    Abstract translation: 本公开涉及一种照明装置。 照明装置包括产生光的光子器件。 照明装置包括其上设置有光子装置的印刷电路板（PCB）。 照明装置包括具有覆盖PCB和光子装置的弯曲轮廓的扩散器盖。 扩散器盖具有纹理表面，用于散射由光子器件产生的光。 照明装置包括导热杯，该导热杯围绕扩散器盖并与PCB导热耦合。 杯子具有反射透射通过扩散器盖的光的反射内表面。 照明装置包括用于散发由光子器件产生的热的散热结构。 散热结构热耦合到杯子。

    LIGHT EMITTING DIODE WITH MICRO-STRUCTURE LENS
    6.
    发明申请
    LIGHT EMITTING DIODE WITH MICRO-STRUCTURE LENS 有权
    具有微结构镜片的发光二极管

    公开(公告)号：US20150162490A1

    公开(公告)日：2015-06-11

    申请号：US14620481

    申请日：2015-02-12

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Hsiao-Wen Lee ,  Shang-yu Tsai ,  Pei-Wen Ko

    IPC: H01L33/00 ,  H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/005 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

    Abstract: A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens.

    Abstract translation: 具有微结构透镜的发光二极管（LED）包括LED管芯和微结构透镜。 微结构透镜包括凸透镜部分，围绕凸透镜部分的至少一个同心脊结构，以及在凸透镜部分下方的下部和至少一个同心脊结构。 下部布置成设置在LED管芯上。 从LED管芯的边缘到微结构透镜的顶部中心的第一光路长度与从LED管芯的边缘到微结构透镜侧的第二光程长度基本相同。

    LIGHT-EMITTING-DIODE-BASED LIGHT BULB
    7.
    发明申请
    LIGHT-EMITTING-DIODE-BASED LIGHT BULB 有权
    基于发光二极管的灯泡

    公开(公告)号：US20140307435A1

    公开(公告)日：2014-10-16

    申请号：US14316942

    申请日：2014-06-27

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

    IPC: F21K99/00

    CPC classification number: F21K9/64 ,  F21K9/232 ,  F21V3/08 ,  F21V7/041 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/60 ,  F21Y2115/10

    Abstract: A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point.

    Abstract translation: 照明装置包括第一基板，设置在第一基板上的多个第一发光元件，设置在第一基板上的第二基板和设置在第二基板上的多个第二发光元件。 反射表面设置在第一基板和第二基板之间。 反射表面被配置为将至少一些第一发光器件发射的光沿至少部分地朝向第一衬底的方向反射。 反射表面具有以下之一：锯图案侧视图轮廓或不具有拐点的弯曲侧视图轮廓。

    LED Lighting Apparatus with Flexible Light Modules
    8.
    发明申请
    LED Lighting Apparatus with Flexible Light Modules 有权
    具有柔性灯模块的LED照明设备

    公开(公告)号：US20140198499A1

    公开(公告)日：2014-07-17

    申请号：US14224891

    申请日：2014-03-25

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Jin-Hua Wang ,  Hsueh-Hung Fu ,  Pei-Wen Ko ,  Chih-Hsuan Sun

    IPC: F21V17/02 ,  F21V5/00 ,  F21V29/00 ,  F21K99/00

    CPC classification number: F21V17/02 ,  F21K9/20 ,  F21K9/60 ,  F21V5/007 ,  F21V13/04 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/83 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2113/00 ,  F21Y2115/10 ,  Y02B20/72

    Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

    Abstract translation: 本公开涉及路灯。 路灯包括基座，连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。

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