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    Semiconductor apparatus and adjustment method
    2.
    发明授权
    Semiconductor apparatus and adjustment method 有权
    半导体装置及调整方法

    公开(公告)号：US09589820B2

    公开(公告)日：2017-03-07

    申请号：US14725317

    申请日：2015-05-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

    Inventor： Yao-Hwan Kao ,  Ching-Hai Yang ,  Po-Chun Lee

    IPC: H01L21/67 ,  H01L21/683 ,  H01L51/00 ,  B41J3/44 ,  B82Y30/00 ,  H01L21/02

    CPC classification number: H01L21/67288 ,  B41J3/445 ,  B82Y30/00 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/67017 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/6831 ,  H01L51/0005

    Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes a wafer chuck configured to hold a wafer, and a first nozzle configured to dispense first chemical liquid onto the wafer. The semiconductor apparatus also includes a second nozzle configured to dispense second chemical liquid onto the wafer at a first dispensing time after the first nozzle stops dispensing the first chemical liquid. The semiconductor apparatus also includes an image device configured to take images of the first nozzle and the second nozzle in sequence, and a processing module configured to analyze the images. The processing module adjusts the first dispensing time when a first defect image shows the first chemical liquid and the second chemical liquid existing in a space close to the first and the second nozzles and flowing to the wafer.

    Abstract translation: 提供一种半导体装置。 该半导体装置包括构造成保持晶片的晶片卡盘和构造成将第一化学液体分配到晶片上的第一喷嘴。 半导体装置还包括第二喷嘴，其被配置为在第一喷嘴停止分配第一化学液体之后的第一分配时间将第二化学液体分配到晶片上。 半导体装置还包括被配置为依次拍摄第一喷嘴和第二喷嘴的图像的图像装置，以及被配置为分析图像的处理模块。 当第一缺陷图像显示存在于靠近第一和第二喷嘴的空间中并流到晶片的第一化学液体和第二化学液体时，处理模块调节第一分配时间。

    SPIN DISPENSER MODULE SUBSTRATE SURFACE PROTECTION SYSTEM
    3.
    发明申请
    SPIN DISPENSER MODULE SUBSTRATE SURFACE PROTECTION SYSTEM 有权

    公开(公告)号：US20220288627A1

    公开(公告)日：2022-09-15

    申请号：US17826561

    申请日：2022-05-27

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Ching-Hai Yang ,  Yao-Hwan Kao ,  Shang-Sheng Li ,  Kuo-Pin Chen ,  Hsiang-Kai Tseng ,  Chuan-Wei Chen

    IPC: B05C11/10 ,  B05C11/08 ,  B05B11/00 ,  G03F7/16 ,  G03F7/30 ,  H01L21/67

    Abstract: A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

    Baking apparatus and method
    4.
    发明授权
    Baking apparatus and method 有权
    烘烤设备和方法

    公开(公告)号：US09536759B2

    公开(公告)日：2017-01-03

    申请号：US14725285

    申请日：2015-05-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

    Inventor： Ching-Hai Yang ,  Shang-Sheng Li ,  Yao-Hwan Kao

    IPC: H01L21/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  H01L21/02

    CPC classification number: H01L21/67115 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68 ,  H01L21/687 ,  H01L21/68764

    Abstract: A baking apparatus for baking a wafer is provided. The baking apparatus includes a wafer chuck configured to hold the wafer, and a heating device disposed over the wafer chuck and configured to heat the wafer. The baking apparatus also includes a carrying arm configured to transport the wafer over the wafer chuck. The wafer chuck is in physical contact with the center area of the bottom surface of the wafer when the wafer is held by the wafer chuck.

    Abstract translation: 提供了一种用于烘烤晶片的烘烤装置。 烘烤装置包括构造成保持晶片的晶片卡盘和设置在晶片卡盘上方并构造成加热晶片的加热装置。 烘烤设备还包括配置成将晶片输送到晶片卡盘上的承载臂。 当晶片被晶片卡盘保持时，晶片卡盘与晶片的底表面的中心区域物理接触。

    WAFER BACKSIDE CLEANING APPARATUS AND METHOD OF CLEANING WAFER BACKSIDE
    7.
    发明申请
    WAFER BACKSIDE CLEANING APPARATUS AND METHOD OF CLEANING WAFER BACKSIDE 审中-公开

    公开(公告)号：US20200171623A1

    公开(公告)日：2020-06-04

    申请号：US16691061

    申请日：2019-11-21

    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

    Inventor： Ching-Hai Yang ,  Yao-Hwan Kao ,  Huang-Sheng Liu

    IPC: B24D11/00 ,  B24B7/22

    Abstract: A wafer cleaning and polishing pad includes a pad having a polishing surface, wherein the polishing surface includes a first material having a Shore D hardness ranging from 50 to 80 and a static coefficient of friction ranging from 0.01 to 0.6. The first material is a fluoropolymer. The pad includes a middle layer and/or a base under the polishing surface. The base includes a second material and the middle layer includes a third material having a lower surface hardness and a higher coefficient of friction than the first material. The polishing surface includes a plurality of grooves with varying groove depth from center of the pad to an edge of the pad.

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