Developing apparatus, developing method and storage medium
    1.
    发明授权
    Developing apparatus, developing method and storage medium 有权
    显影装置,显影方法和存储介质

    公开(公告)号:US09575411B2

    公开(公告)日:2017-02-21

    申请号:US14450704

    申请日:2014-08-04

    Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

    Abstract translation: 显影装置包括:水平保持基板的基板支架; 显影剂喷嘴,其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构,其包括旋转构件,所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转,从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。

    Developing method, computer-readable storage medium and developing apparatus

    公开(公告)号:US10921713B2

    公开(公告)日:2021-02-16

    申请号:US16560137

    申请日:2019-09-04

    Abstract: A developing method includes: forming a liquid pool of a diluted developing solution diluted with pure water in a central portion of a substrate; forming a liquid film of the diluted developing solution on a surface of the substrate by accelerating rotation of the substrate to diffuse the liquid pool of the diluted developing solution on the entire surface of the substrate; and then supplying a developing solution onto the substrate. Supplying a developing solution includes: supplying the developing solution from a developing solution supply nozzle having a liquid contact surface while securing a gap having a predetermined size between the developing solution supply nozzle and the substrate; and moving the developing solution supply nozzle in a radial direction passing through a center of the substrate while forming a liquid pool of the developing solution between the substrate and the liquid contact surface of the developing solution supply nozzle.

    Developing method, computer-readable storage medium and developing apparatus

    公开(公告)号:US10459340B2

    公开(公告)日:2019-10-29

    申请号:US14953109

    申请日:2015-11-27

    Abstract: A developing method includes: forming a liquid pool of a diluted developing solution diluted with pure water in a central portion of a substrate; forming a liquid film of the diluted developing solution on a surface of the substrate by accelerating rotation of the substrate to diffuse the liquid pool of the diluted developing solution on the entire surface of the substrate; and then supplying a developing solution onto the substrate. Supplying a developing solution includes: supplying the developing solution from a developing solution supply nozzle having a liquid contact surface while securing a gap having a predetermined size between the developing solution supply nozzle and the substrate; and moving the developing solution supply nozzle in a radial direction passing through a center of the substrate while forming a liquid pool of the developing solution between the substrate and the liquid contact surface of the developing solution supply nozzle.

    Substrate cleaning apparatus, substrate cleaning method, and storage medium

    公开(公告)号:US09947556B2

    公开(公告)日:2018-04-17

    申请号:US14321054

    申请日:2014-07-01

    CPC classification number: H01L21/67051 H01L21/67046 H01L21/68792

    Abstract: There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

    Liquid processing apparatus
    7.
    发明授权

    公开(公告)号:US10014190B2

    公开(公告)日:2018-07-03

    申请号:US14339539

    申请日:2014-07-24

    CPC classification number: H01L21/67051 H01L21/6715

    Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

    Developing method, developing apparatus and storage medium
    8.
    发明授权
    Developing method, developing apparatus and storage medium 有权
    显影方法,显影装置和存储介质

    公开(公告)号:US09568829B2

    公开(公告)日:2017-02-14

    申请号:US14449419

    申请日:2014-08-01

    Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

    Abstract translation: 显影方法包括:通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂,在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动,将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触,接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面, 小于衬底的表面。 根据该方法,能够抑制向基板外侧落下的液体的量。 此外,由于可以降低基板的旋转速度,可以抑制显影剂的飞溅。 此外,可以通过搅拌显影剂来提高生产量。

    Liquid processing apparatus
    9.
    发明授权

    公开(公告)号:US11031261B2

    公开(公告)日:2021-06-08

    申请号:US16014308

    申请日:2018-06-21

    Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

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