公开(公告)号：US11469114B2

公开(公告)日：2022-10-11

申请号：US17063169

申请日：2020-10-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/56 ,  H01L21/02

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US11615971B2

公开(公告)日：2023-03-28

申请号：US16712405

申请日：2019-12-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Teruaki Konishi ,  Kouzou Kanagawa ,  Osamu Kuroda ,  Koji Tanaka ,  Kotaro Tsurusaki ,  Hidemasa Aratake ,  Kouji Ogura ,  Keita Hirase

IPC: H01L21/67 ,  H01L21/311

Abstract: There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.

公开(公告)号：US11476130B2

公开(公告)日：2022-10-18

申请号：US16805898

申请日：2020-03-02

Applicant: Tokyo Electron Limited

Inventor： Kotaro Tsurusaki ,  Koji Yamashita ,  Kazuya Koyama ,  Kouzou Kanagawa

IPC: H01L21/67 ,  H01L21/687 ,  B05B1/00 ,  B05B13/02

Abstract: A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.

公开(公告)号：US20200286754A1

公开(公告)日：2020-09-10

申请号：US16805898

申请日：2020-03-02

Applicant: Tokyo Electron Limited

Inventor： Kotaro Tsurusaki ,  Koji Yamashita ,  Kazuya Koyama ,  Kouzou Kanagawa

IPC: H01L21/67 ,  H01L21/687 ,  B05B13/02 ,  B05B1/00

Abstract: A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.

公开(公告)号：US12183613B2

公开(公告)日：2024-12-31

申请号：US17061967

申请日：2020-10-02

Applicant: Tokyo Electron Limited

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/677 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a loading/unloading part into/from which a cassette that accommodates a plurality of substrates is loaded/unloaded; a batch-type processing part configured to collectively process a lot including the plurality of substrates; a single-substrate-type processing part configured to the plurality of substrates of the lot one by one; and an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, wherein the loading/unloading part, the single-substrate-type processing part, the interface part, and the batch-type processing part are arranged in this order, and wherein the interface part comprises a lot formation part configured to form the lot, and a transfer part configured to transfer the plurality of substrates from the single-substrate-type processing part to the lot formation part, and configured to transfer the plurality of substrates from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US12042815B2

公开(公告)日：2024-07-23

申请号：US17489045

申请日：2021-09-29

Applicant: Tokyo Electron Limited

Inventor： Kotaro Tsurusaki ,  Koji Yamashita ,  Yusuke Yamamoto ,  Koji Tanaka ,  Kouzou Kanagawa

IPC: B05C3/109 ,  B05C3/02 ,  B05C11/00 ,  B05C11/10 ,  B05D1/20 ,  C25D21/04 ,  H01L21/67 ,  B05C3/00

CPC classification number: B05C3/109 ,  B05C3/02 ,  B05C11/00 ,  B05C11/1013 ,  B05D1/20 ,  C25D21/04 ,  H01L21/67017 ,  H01L21/67057 ,  B05C3/00

Abstract: A substrate processing apparatus includes a processing tank, a holder, an organic solvent supply, a drainage port, a gas supply, and an exhaust port. The processing tank stores an aqueous layer. The holder holds a substrate. The organic solvent supply supplies an organic solvent onto the aqueous layer to form a liquid layer of the organic solvent. The drainage port discharges the aqueous layer from a bottom wall of the processing tank and causes the liquid layer of the organic solvent to descend from above the substrate to below the substrate. The gas supply supplies a gas of a water repellent agent to the liquid layer from above the processing tank while the liquid layer descends. The exhaust port is exposed on a side wall of the processing tank by the descending of the liquid layer and discharges the gas of the water repellent gas.

公开(公告)号：US11978644B2

公开(公告)日：2024-05-07

申请号：US17886687

申请日：2022-08-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/56 ,  H01L21/02

CPC classification number: H01L21/561 ,  H01L21/02101

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20200286751A1

公开(公告)日：2020-09-10

申请号：US16804056

申请日：2020-02-28

Applicant: Tokyo Electron Limited

Inventor： Kazuya Koyama ,  Kotaro Tsurusaki ,  Koji Yamashita

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates exposed from the liquid surfaces. The controller moves up the ejection position of the vapor of the organic solvent by the ejection unit as the plurality of substrates are moved up.