Abstract:
At least one inert-gas supply section is provided in a coating section and a light-irradiating section that are sealingly coupled to each other at a side of the coating section where a base material enters, the coating section coating a photopolymerizable composition onto the base material and the light-irradiating section applying light to the photopolymerizable composition layer after coating. Inert gas supplied from a first inert-gas supply section is sprayed from the inert-gas chamber toward the base material, and is supplied into each of the coating section and the light irradiating section.
Abstract:
A pressure-sensitive adhesive composition or an acrylic pressure-sensitive adhesive tape in which peeling-off property or tearing-off property occurring by heating is improved while the high adhesiveness to a metallic material is being maintained, will be provided. The pressure-sensitive adhesive composition contains: an acrylic polymer (A); a (meth)acrylic polymer (B) whose mass average molecular weight (Mw) is such that 1000≦Mw
Abstract:
The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.
Abstract:
A conductive pressure-sensitive adhesive tape contains an acrylic pressure-sensitive adhesive, a conductive filler, and a heating foaming agent. An acrylic polymer can be preferably used as the acrylic pressure-sensitive adhesive. With the multiple conductive fillers being electrically connected to each other, conductive paths communicating from one of the major surfaces of the tape to the other major surface thereof are formed before temperature sensing. The heating foaming agent is a heating-type foaming agent that is foamed by being heated. The electrical connection between the conductive fillers, which has been formed before the heating foaming agent is foamed, is disconnected by the foamed heating foaming agent, and the conductive paths communicating from one of the major surfaces of the tape to the other major surface thereof are eliminated.
Abstract:
Disclosed is a pressure-sensitive adhesive tape or sheet having an adhesive face which includes two or more different pressure-sensitive adhesives each capable of acting on an adherend and exhibits adhesiveness and debonding capability both at high levels. The pressure-sensitive adhesive tape or sheet has an adhesive face being substantially smooth and including at least on region composed of a first pressure-sensitive adhesive and at least one region composed of a pressure-sensitive adhesive other than the first pressure-sensitive adhesive. In the pressure-sensitive adhesive tape or sheet, the region composed of the first pressure-sensitive adhesive and the region composed of the other pressure-sensitive adhesive than the first pressure-sensitive adhesive preferably are preferably in the form of stripes extending in the longitudinal direction.
Abstract:
The present invention relates to a pressure-sensitive adhesive composition comprising: a monomer mixture comprising the following (a1), (a2) and (a3) or partially polymerized product thereof; and thermal-expandable fine particles: (a1): alkyl (meth)acrylate monomer having 4 to 12 carbon atoms in its alkyl moiety and having a glass transition temperature when formed into a homopolymer of lower than 0° C.; (a2): monomer having at least one nitrogen atom and one ethylenically unsaturated bond in its molecule; and (a3): monomer having one ethylenically unsaturated bond in its molecule and having a glass transition temperature when formed into a homopolymer of 0° C. or higher (excluding (a2) above).