公开(公告)号：US20170100916A1

公开(公告)日：2017-04-13

申请号：US14881041

申请日：2015-10-12

Applicant: Tyco Electronics Corporation ,  TE Connectivity Germany GmbH

Inventor： Lavanya Bharadwaj ,  Barry C. Mathews ,  Dominique Freckmann ,  Shallu Soneja ,  Michael A. Oar ,  Gokce Gulsoy ,  Helge Schmidt ,  Michael Leidner ,  Soenke Sachs

IPC: B32B15/04 ,  B32B37/08 ,  B32B37/06

CPC classification number: B32B15/04 ,  B32B37/06 ,  B32B37/08 ,  B32B2307/554 ,  B32B2457/00 ,  H01L21/324 ,  H05K1/0207 ,  H05K3/125 ,  H05K2203/092 ,  H05K2203/1131

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

公开(公告)号：US20170100744A1

公开(公告)日：2017-04-13

申请号：US14881051

申请日：2015-10-12

Applicant: Tyco Electronics Corporation

Inventor： Shallu Soneja ,  Min Zheng ,  Dov Nitzan ,  Lavanya Bharadwaj ,  Barry C. Mathews ,  Michael A. Oar ,  Gokce Gulsoy

IPC: B05D3/06

CPC classification number: B05D3/06 ,  C23C26/00 ,  C23C28/021 ,  C23C28/026 ,  H01R13/03

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.

公开(公告)号：US20180063967A1

公开(公告)日：2018-03-01

申请号：US15249148

申请日：2016-08-26

Applicant: Tyco Electronics Corporation

Inventor： Miguel A. Morales ,  Leonard H. Radzilowski ,  Barry C. Mathews ,  Michael A. Oar

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  B23K1/00 ,  B23K20/00 ,  B23K35/26 ,  C08J7/04

CPC classification number: C08J7/047 ,  B23K1/0016 ,  B23K1/005 ,  B23K1/0056 ,  B23K1/20 ,  B23K1/203 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K2101/32 ,  B23K2101/42 ,  B23K2103/172 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/341 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/09118 ,  H05K2201/10287 ,  Y02P70/613

Abstract: A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.

公开(公告)号：US20170238425A1

公开(公告)日：2017-08-17

申请号：US15043473

申请日：2016-02-12

Applicant: Tyco Electronics Corporation

Inventor： Barry C. Mathews ,  Yiliang Wu ,  Miguel A. Morales ,  Michael A. Oar ,  Leonard Henry Radzilowski ,  Juliana B. De Guzman

IPC: H05K3/22

CPC classification number: H05K3/22 ,  C09D11/52 ,  H05K1/097 ,  H05K3/12 ,  H05K3/1283 ,  H05K2203/088 ,  H05K2203/1131

Abstract: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.

公开(公告)号：US20170236610A1

公开(公告)日：2017-08-17

申请号：US15043468

申请日：2016-02-12

Applicant: Tyco Electronics Corporation

Inventor： Yiliang Wu ,  Barry C. Mathews ,  Miguel A. Morales ,  Leonard Henry Radzilowski ,  Michael A. Oar ,  Ranjan Deepak Deshmukh ,  James Paul Scholz ,  Bruce Foster Bishop ,  Jerry L. Moore

IPC: H01B1/02 ,  C09D11/037 ,  H01B13/00 ,  C09D11/52

CPC classification number: H01B1/02 ,  B82Y30/00 ,  C08G77/26 ,  C08K2003/0806 ,  C09D4/00 ,  C09D5/002 ,  C09D5/24 ,  C09D7/61 ,  C09D11/03 ,  C09D11/037 ,  C09D11/52 ,  C09D183/08 ,  H01B1/22 ,  H01B13/0026 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/389 ,  H05K2203/1131 ,  C08K3/08 ,  C08L83/08 ,  C08K9/06

Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

公开(公告)号：US20170233541A1

公开(公告)日：2017-08-17

申请号：US15043460

申请日：2016-02-12

Applicant: Tyco Electronics Corporation

Inventor： Yiliang Wu ,  Barry C. Mathews ,  Michael A. Oar ,  Miguel A. Morales ,  Leonard Henry Radzilowski ,  James Paul Scholz ,  Bruce Foster Bishop ,  Jerry L. Moore

IPC: C08J7/04 ,  C23C4/129 ,  B05D1/00 ,  B05D1/30 ,  B05D1/02 ,  B05D1/18

CPC classification number: C08J7/045 ,  B05D1/005 ,  B05D1/02 ,  B05D1/18 ,  B05D1/30 ,  B05D3/0254 ,  B05D3/144 ,  B05D5/12 ,  B05D7/02 ,  B05D7/546 ,  C08J2369/00 ,  C08J2429/04 ,  C08J2429/14 ,  C09D5/002 ,  C09D11/037 ,  C09D11/106 ,  C09D11/52 ,  C09D129/14 ,  C23C4/129 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K3/125 ,  H05K3/386 ,  H05K2203/1131

Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.