公开(公告)号：USD969745S1

公开(公告)日：2022-11-15

申请号：US29696004

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Designer： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen ,  Kuei-Sheng Wu

公开(公告)号：US20180315714A1

公开(公告)日：2018-11-01

申请号：US15498435

申请日：2017-04-26

Applicant: Unimicron Technology Corp.

Inventor： Jui-Chun Kuo ,  Chuang-Yi Chiu ,  Kuei-Sheng Wu ,  Wen-Shen Lo

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/055 ,  H01L23/31 ,  H01L23/06 ,  H01L21/52 ,  H01L21/48 ,  H01L21/56

Abstract: A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a circuit board, a chip, a housing, an antenna pattern, a conductive line pattern and a shielding layer. The chip is disposed on the circuit board. The housing is disposed on the circuit board and covers the chip, wherein the housing includes a cover and sidewalls, and the housing contains catalyst particles. The antenna pattern is disposed on an outer surface of the cover. The conductive line pattern is disposed on an outer surface of the sidewalls and electrically connected to the antenna pattern and the circuit board. The shielding layer is disposed at least on an inner surface of the cover.