公开(公告)号：USD969745S1

公开(公告)日：2022-11-15

申请号：US29696004

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Designer： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen ,  Kuei-Sheng Wu

公开(公告)号：US10952325B2

公开(公告)日：2021-03-16

申请号：US16451031

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

公开(公告)号：US20200329562A1

公开(公告)日：2020-10-15

申请号：US16451031

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.