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公开(公告)号：US20220240367A1
公开(公告)日：2022-07-28
申请号：US17198287
申请日：2021-03-11
Applicant: Unimicron Technology Corp.
Inventor： Ming-Hao WU , Kuo-Wei LI
Abstract: A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.
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公开(公告)号：US20160363974A1
公开(公告)日：2016-12-15
申请号：US15247902
申请日：2016-08-25
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju CHEN , Ming-Hao WU , Cheng-Po YU
IPC: G06F1/20 , H01L23/498 , H05K1/18 , H01L35/30 , H05K1/02
CPC classification number: H05K3/4647 , G06F1/206 , H01L23/12 , H01L23/13 , H01L23/4275 , H01L23/49827 , H01L35/30 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H05K1/0203 , H05K1/0206 , H05K1/113 , H05K1/14 , H05K1/181 , H05K1/185 , H05K1/187 , H05K3/36 , H05K3/4697 , H05K2201/048 , H05K2201/10219 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734
Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。
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Patent Agency Ranking
公开(公告)号：US20220087033A1
公开(公告)日：2022-03-17
申请号：US17083271
申请日：2020-10-28
Applicant: Unimicron Technology Corp.
Inventor： Ming-Hao WU , Hsuan-Wei CHEN
Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.
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公开(公告)号：US20240114632A1
公开(公告)日：2024-04-04
申请号：US18062739
申请日：2022-12-07
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： Ming-Hao WU , Chia-Ching WANG
CPC classification number: H05K3/429 , H05K1/115 , H05K2201/09509 , H05K2203/0207
Abstract: A circuit board structure is provided. The circuit board structure includes a via hole, a conductive layer, and an alternate stacking of a plurality of circuit layers and a plurality of insulating layers. The via hole penetrates through the plurality of circuit layers and the plurality of insulating layers. The lateral ends of the plurality of insulating layers form the sidewall of the via hole. The conductive layer is conformally disposed within the via hole. The conductive layer exposes the first region of the sidewall and covers the second region of the sidewall. The sidewall extends in the longitudinal direction of the via hole and has no misalignments in the radial direction.
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公开(公告)号：US20180116056A1
公开(公告)日：2018-04-26
申请号：US15849624
申请日：2017-12-20
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju CHEN , Ming-Hao WU , Cheng-Po YU
IPC: H05K3/46 , H05K1/18 , H01L23/12 , H01L23/498 , H01L35/30 , H05K1/02 , H05K3/36 , G06F1/20 , H05K1/14 , H05K1/11
CPC classification number: H05K3/4647 , G06F1/206 , H01L23/12 , H01L23/13 , H01L23/4275 , H01L23/49827 , H01L35/30 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H05K1/0203 , H05K1/0206 , H05K1/113 , H05K1/14 , H05K1/181 , H05K1/185 , H05K1/187 , H05K3/36 , H05K3/4697 , H05K2201/048 , H05K2201/10219 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734
Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
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公开(公告)号：US20170034925A1
公开(公告)日：2017-02-02
申请号：US15289950
申请日：2016-10-10
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju CHEN , Ming-Hao WU , Cheng-Po YU
IPC: H05K3/46 , H05K3/30 , H05K1/11 , H05K1/14 , H05K1/18 , H01L35/30 , H05K3/36 , H05K3/40 , H05K1/02
CPC classification number: H05K3/4647 , G06F1/206 , H01L23/12 , H01L23/13 , H01L23/4275 , H01L23/49827 , H01L35/30 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H05K1/0203 , H05K1/0206 , H05K1/113 , H05K1/14 , H05K1/181 , H05K1/185 , H05K1/187 , H05K3/36 , H05K3/4697 , H05K2201/048 , H05K2201/10219 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734
Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。
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公开(公告)号：US20160316565A1
公开(公告)日：2016-10-27
申请号：US14695057
申请日：2015-04-24
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju CHEN , Ming-Hao WU , Cheng-Po YU
CPC classification number: H05K3/4647 , G06F1/206 , H01L23/12 , H01L23/13 , H01L23/4275 , H01L23/49827 , H01L35/30 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H05K1/0203 , H05K1/0206 , H05K1/113 , H05K1/14 , H05K1/181 , H05K1/185 , H05K1/187 , H05K3/36 , H05K3/4697 , H05K2201/048 , H05K2201/10219 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734
Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
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