公开(公告)号：US11477886B2

公开(公告)日：2022-10-18

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US20170110393A1

公开(公告)日：2017-04-20

申请号：US15391861

申请日：2016-12-28

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Kai-Ming Yang ,  Wang-Hsiang Tsai ,  Tzyy-Jang Tseng

IPC: H01L23/498 ,  H01L21/683 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/4673 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/10674 ,  Y10T29/49165 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.

公开(公告)号：US20220232702A1

公开(公告)日：2022-07-21

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US11895780B2

公开(公告)日：2024-02-06

申请号：US17194323

申请日：2021-03-08

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming Yang ,  Chen-Hao Lin ,  Wang-Hsiang Tsai ,  Cheng-Ta Ko

IPC: H05K3/46 ,  H05K3/40 ,  H01L23/538 ,  H01L21/768 ,  H01L21/48 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/36 ,  H01L23/00 ,  H01L21/683 ,  H05K1/02

CPC classification number: H05K3/4038 ,  H01L21/486 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/15 ,  H01L23/36 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H05K1/11 ,  H05K1/112 ,  H05K1/142 ,  H05K1/183 ,  H05K3/4644 ,  H05K3/4673 ,  H01L23/145 ,  H01L23/49816 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/37001 ,  H05K1/0271 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49165 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2224/131 ,  H01L2924/014

Abstract: A method of manufacturing package structures includes providing a carrier including a supporting layer, a metal layer, and a release layer between the supporting layer and the metal layer at first. Afterwards, a composite layer of a non-conductor inorganic material and an organic material is disposed on the metal layer. Then, a chip embedded substrate is bonded on the composite layer. Afterwards, an insulating protective layer having openings is formed on the circuit layer structure and exposes parts of the circuit layer structure in the openings. Afterwards, the supporting layer and the release layer are removed to form two package substrates. Then, each of the package substrates is cut.

公开(公告)号：US11127664B2

公开(公告)日：2021-09-21

申请号：US15391861

申请日：2016-12-28

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Kai-Ming Yang ,  Wang-Hsiang Tsai ,  Tzyy-Jang Tseng

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H05K3/46 ,  H01L23/14 ,  H01L23/15

Abstract: A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.