公开(公告)号：US11477886B2

公开(公告)日：2022-10-18

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US20220232702A1

公开(公告)日：2022-07-21

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US20250149392A1

公开(公告)日：2025-05-08

申请号：US18395755

申请日：2023-12-26

Applicant: Unimicron Technology Corp.

Inventor： Chia Ching Wang ,  Chien-Chou Chen ,  Hsuan Ming Hsu ,  Ho-Shing Lee ,  Yunn-Tzu Yu ,  Yao Yu Chiang ,  Po-Wei Chen ,  Wei-Ti Lin ,  Wen Chi Chang

IPC: H01L23/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A package substrate includes a core layer, at least one functional component, at least one spacer, a filler, a first and a second build-up structures. The core layer has at least one opening and multiple conductive through vias. The functional component is disposed in the openings. The spacer is disposed on the functional component. The filler is filled in the opening, covering the functional component and spacer, and completely filling the gap between the opening, the functional component and the spacer. The first build-up structure is disposed on a first surface of the core layer and a third surface of the filler, and electrically connected to the functional component and the conductive through vias. The second build-up structure is disposed on a second surface of the core layer and a fourth surface of the filler, contacts the spacer and electrically connected to the conductive through vias.