公开(公告)号：US20230197587A1

公开(公告)日：2023-06-22

申请号：US17555106

申请日：2021-12-17

Applicant: WOLFSPEED, INC.

Inventor： Donald FARRELL ,  Marvin MARBELL ,  Jeremy FISHER ,  Dan NAMISHIA ,  Scott SHEPPARD ,  Dan ETTER

IPC: H01L23/495 ,  H01L23/64 ,  H01L23/00

CPC classification number: H01L23/49589 ,  H01L23/645 ,  H01L23/647 ,  H01L23/49575 ,  H01L24/85 ,  H01L29/778

Abstract: A transistor device includes a metal submount; a transistor die arranged on said metal submount; at least one integrated passive device (IPD) component that includes a substrate arranged on said metal submount; and one or more interconnects extending between the transistor die and the at least one integrated passive device (IPD) component. The substrate includes a silicon carbide (SiC) substrate.

公开(公告)号：US20220216175A1

公开(公告)日：2022-07-07

申请号：US17702868

申请日：2022-03-24

Applicant: WOLFSPEED, INC.

Inventor： Sung Chul JOO ,  Jack POWELL ,  Donald FARRELL ,  Bradley MILLON

IPC: H01L23/00 ,  H01L23/66 ,  H01P11/00 ,  H01P3/00

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.