Spectroscopy
    1.
    发明授权
    Spectroscopy 失效
    光谱学

    公开(公告)号:US5926272A

    公开(公告)日:1999-07-20

    申请号:US833669

    申请日:1997-04-08

    CPC classification number: G01J3/28 G01J3/18 G01J3/02

    Abstract: A system for spectroscopic monitoring that includes a broadband source of radiation, structure defining a non-elongate entrance aperture for receiving radiation to be analyzed along a first path; dispersion structure disposed in the first path for spatially dispersing the radiation in the first path as a function of wavelength, structure defining a non-elongate exit aperture for receiving a portion of the dispersed radiation, detector structure for detecting radiation passed through said exit aperture structure, and conical astigmatism reducing reflector structure disposed in the radiation path between the dispersion structure and the exit aperture structure for reducing astigmatism.

    Abstract translation: 一种用于光谱监测的系统,其包括宽带辐射源,结构限定非细长入口孔,用于接收沿着第一路径分析的辐射; 分散结构,设置在第一路径中,用于将第一路径中的辐射空间分散为波长的函数,结构限定用于接收一部分分散辐射的非细长出口孔,用于检测通过所述出口孔结构的辐射的检测器结构 以及设置在分散结构和出射孔结构之间的辐射路径中的锥形像散减小反射器结构,用于减少散光。

    Monitoring technology
    2.
    再颁专利

    公开(公告)号:USRE33789E

    公开(公告)日:1992-01-07

    申请号:US515433

    申请日:1990-04-26

    CPC classification number: G01N21/552 G01N2021/3595 G01N2021/432 G01N2201/08

    Abstract: A process for infrared spectroscopic monitoring of insitu compositional changes in a polymeric material comprises the steps of providing an elongated infrared radiation transmitting fiber that has a transmission portion and a sensor portion, embedding the sensor portion in the polymeric material to be monitored, subjecting the polymeric material to a processing sequence, applying a beam of infrared radiation to the fiber for transmission through the transmitting portion to the sensor portion for modification as a function of properties of the polymeric material, monitoring the modified infrared radiation spectra as the polymeric material is being subjected to the processing sequence to obtain kinetic data on changes in the polymeric material during the processing sequence, and adjusting the processing sequence as a function of the kinetic data provided by the modified infrared radiation spectra information.

    Monitoring technology
    3.
    发明授权
    Monitoring technology 失效
    监控技术

    公开(公告)号:US4798954A

    公开(公告)日:1989-01-17

    申请号:US10306

    申请日:1987-02-03

    CPC classification number: G01N21/552 G01N2021/3595 G01N2021/432 G01N2201/08

    Abstract: A process for infrared spectroscopic monitoring of insitu compositional changes in a polymeric material comprises the steps of providing an elongated infrared radiation transmitting fiber that has a transmission portion and a sensor portion, embedding the sensor portion in the polymeric material to be monitored, subjecting the polymeric material to a processing sequence, applying a beam of infrared radiation to the fiber for transmission through the transmitting portion to the sensor portion for modification as a function of properties of the polymeric material, monitoring the modified infrared radiation spectra as the polymeric material is being subjected to the processing sequence to obtain kinetic data on changes in the polymeric material during the processing sequence, and adjusting the processing sequence as a function of the kinetic data provided by the modified infrared radiation spectra information.

    Abstract translation: 用于红外光谱监测聚合物材料的本体组成变化的方法包括以下步骤:提供细长的红外辐射透射纤维,其具有透射部分和传感器部分,将传感器部分嵌入待监测的聚合物材料中, 材料加工成处理顺序,将一束红外线辐射施加到纤维上,用于通过透射部分传递到传感器部分以作为聚合物材料的性质的变化,以监测聚合物材料受到的改进的红外辐射光谱 以获得关于处理序列期间聚合物材料变化的动力学数据,以及根据经修改的红外辐射光谱信息提供的动力学数据调整处理顺序。

    Tapered optical fiber sensing attenuated total reflectance
    7.
    发明授权
    Tapered optical fiber sensing attenuated total reflectance 失效
    光纤光纤传感衰减总反射

    公开(公告)号:US5239176A

    公开(公告)日:1993-08-24

    申请号:US771157

    申请日:1991-10-03

    CPC classification number: G01N21/552 Y10S250/905

    Abstract: A radiation transmission fiber for spectroscopic monitoring includes a transmission portion and a sensor portion; the transmission and sensor portions have a continuous core portion and continuous cladding over the core portion throughout the transmission and sensor portions; the sensor portion of the core is of smaller diameter than the transmission portion(s) and is connected to the transmission portion(s) by a conical transition portion(s); and the cladding in the transmission portion is of greater thickness than the cladding in the sensor region.

    Abstract translation: 用于光谱监测的辐射透射光纤包括透射部分和传感器部分; 传输和传感器部分在整个传输和传感器部分中具有连续的核心部分和在核心部分上的连续包层; 芯的传感器部分的直径小于传输部分,并且通过锥形过渡部分连接到传动部分; 并且传输部分中的包层的厚度大于传感器区域中的包层。

    Lyotropic liquid crystalline oriented polymer substrate for printed wire
board
    8.
    发明授权
    Lyotropic liquid crystalline oriented polymer substrate for printed wire board 失效
    用于印刷线路板的溶致液晶取向聚合物基板

    公开(公告)号:US4871595A

    公开(公告)日:1989-10-03

    申请号:US942150

    申请日:1986-12-16

    Abstract: The present invention is directed to the use of ordered polymers as a substrate material for the preparation of printed wire boards (PWB). In preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages. Specific chip package density requirements are 0.020-in. centers with up to 300 input/outputs (I/Os) for perimeter type packages and 0.050-in. center grid array type packages with up to 240 I/Os per device. In its most preferred embodiments, the present invention is directed to a method of forming a PBT PWB substrate layer of 0.0025 in. or less in thickness. Another preferred aspect of the present invention concerns the discovery that a copper layer can be bonded to a PBT film substrate with a strength comparable to existing PWB materials.

    Abstract translation: 本发明涉及使用有序聚合物作为制备印刷线路板(PWB)的基底材料。 在优选实施例中,本发明的PWB包括能够用作高密度无引线周界的通用高密度有机多层PWB和栅格阵列陶瓷芯片封装。 特定芯片封装密度要求为0.020英寸。 中心具有多达300个输入/输出(I / O),用于周边类型包和0.050英寸。 中心网格阵列类型的包,每个设备最多可以有240个I / O。 在其最优选的实施方案中,本发明涉及形成0.0025英寸或更小厚度的PBT PWB基材层的方法。 本发明的另一个优选的方面涉及铜层可以与现有PWB材料相当的强度结合到PBT膜基材上的发现。

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