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公开(公告)号：US20170292912A1
公开(公告)日：2017-10-12
申请号：US15252245
申请日：2016-08-31
Applicant: Winbond Electronics Corp.
Inventor： Yu-Hsuan Ho , Yi-Der Wu
IPC: G01N21/59
CPC classification number: G01N15/00 , G01N15/0211 , G01N15/0272 , G01N2015/0046 , G01N2015/0693
Abstract: A particle sensing device, which senses a particulate matter by using a light beam from a light source, is provided. The particle sensing device includes a columnar array and a light-sensing element. The columnar array is disposed at a downstream side of a traveling path of the light beam. The columnar array has a plurality of columnar objects. A gap is existed between two adjacent columnar objects. The light-sensing element is disposed opposite to the columnar array and at a downstream side of a traveling path of the light beam. Wherein, the traveling path of the light beam is parallel with a length direction of each columnar object. And, the light beam passes through the gap for arriving at the light-sensing element. The particle sensing device can sense the particulate matter satisfactorily and can be simply integrated into various electronic apparatuses.
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公开(公告)号：US20170299489A1
公开(公告)日：2017-10-19
申请号：US15473645
申请日：2017-03-30
Applicant: Winbond Electronics Corp.
Inventor： Yu-Hsuan Ho , Yi-Der Wu
CPC classification number: G01N15/0656 , G01N15/0606 , G01N15/1031 , G01N27/22 , G01N33/0036 , G01N2015/0046
Abstract: A particle sensing device, including a substrate and at least one particle sensing element, is provided. The substrate has a groove, and a through hole is disposed at a bottom of the groove. The through hole penetrates a bottom of the substrate. The particle sensing element is disposed in the substrate. The particle sensing element may include a first electrode pair and a second electrode pair. Two first sub-electrodes of the first electrode pair are disposed nearby two sides of the groove, respectively. And, a first distance is provided between the two first sub-electrodes. Two second sub-electrodes of the second electrode pair are disposed nearby two sides of the groove, respectively. And, a second distance is provided between the two second sub-electrodes. The first distance is smaller than the second distance.
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Patent Agency Ranking
公开(公告)号：US20180106774A1
公开(公告)日：2018-04-19
申请号：US15585170
申请日：2017-05-03
Applicant: Winbond Electronics Corp.
Inventor： Yu-Hsuan Ho , Yi-Der Wu , Yu-Ming Chen
CPC classification number: G01N33/0031 , G01N27/12
Abstract: A sensor array includes a circuit board, a plurality of first sensing units, and at least one second sensing unit. The circuit board has an upper surface and a lower surface that are opposite to each other. The first sensing units are located on the upper surface of the circuit board. The first sensing units include a plurality of first electrodes and a plurality of sensing material layers. The sensing material layers are respectively located on surfaces of the first electrodes, and the sensing material layers are manufactured through applying a non-contact printing method. The second sensing unit is located on the upper surface of the circuit board. The second sensing unit includes a second electrode separated from the first electrodes. The sensing material layers respectively cover the surfaces of the first electrodes, and the second electrode is exposed to an atmospheric environment.
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公开(公告)号：US10585027B2
公开(公告)日：2020-03-10
申请号：US15473645
申请日：2017-03-30
Applicant: Winbond Electronics Corp.
Inventor： Yu-Hsuan Ho , Yi-Der Wu
Abstract: A particle sensing device, including a substrate and at least one particle sensing element, is provided. The substrate has a groove, and a through hole is disposed at a bottom of the groove. The through hole penetrates a bottom of the substrate. The particle sensing element is disposed in the substrate. The particle sensing element may include a first electrode pair and a second electrode pair. Two first sub-electrodes of the first electrode pair are disposed nearby two sides of the groove, respectively. And, a first distance is provided between the two first sub-electrodes. Two second sub-electrodes of the second electrode pair are disposed nearby two sides of the groove, respectively. And, a second distance is provided between the two second sub-electrodes. The first distance is smaller than the second distance.
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公开(公告)号：US10470316B2
公开(公告)日：2019-11-05
申请号：US15808818
申请日：2017-11-09
Applicant: Winbond Electronics Corp.
Inventor： Yu-Ming Chen , Yi-Der Wu
IPC: B29C41/02 , H05K3/46 , H05K3/00 , H05K3/40 , B29C64/30 , B33Y80/00 , B29C64/129 , B29C64/386 , B29C64/124 , B29C64/112 , B29C64/393 , H05K3/12 , B29C64/118 , B29L31/34 , B33Y10/00
Abstract: A manufacturing method of a circuit board includes: performing a first printing process to form a first insulating layer having a first circuit depressed pattern; performing a second printing process to form a first circuit layer in the first circuit depressed pattern; checking whether a real position of the first circuit layer is diverged from a predetermined position; determining whether the shift level of the position of the first circuit layer is more than a predetermined level; performing the first printing process to form the second insulating layer, wherein when the shift level is more than the predetermined level and the thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; and performing the second printing process to form a conductive plug in the hole.
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公开(公告)号：US10161844B2
公开(公告)日：2018-12-25
申请号：US15252245
申请日：2016-08-31
Applicant: Winbond Electronics Corp.
Inventor： Yu-Hsuan Ho , Yi-Der Wu
Abstract: A particle sensing device, which senses a particulate matter by using a light beam from a light source, is provided. The particle sensing device includes a columnar array and a light-sensing element. The columnar array is disposed at a downstream side of a traveling path of the light beam. The columnar array has a plurality of columnar objects. A gap is existed between two adjacent columnar objects. The light-sensing element is disposed opposite to the columnar array and at a downstream side of a traveling path of the light beam. Wherein, the traveling path of the light beam is parallel with a length direction of each columnar object. And, the light beam passes through the gap for arriving at the light-sensing element. The particle sensing device can sense the particulate matter satisfactorily and can be simply integrated into various electronic apparatuses.
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公开(公告)号：US20180139854A1
公开(公告)日：2018-05-17
申请号：US15808818
申请日：2017-11-09
Applicant: Winbond Electronics Corp.
Inventor： Yu-Ming Chen , Yi-Der Wu
Abstract: A manufacturing method of a circuit board includes: performing a first printing process to form a first insulating layer having a first circuit depressed pattern; performing a second printing process to form a first circuit layer in the first circuit depressed pattern; checking whether a real position of the first circuit layer is diverged from a predetermined position; determining whether the shift level of the position of the first circuit layer is more than a predetermined level; performing the first printing process to form the second insulating layer, wherein when the shift level is more than the predetermined level and the thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; and performing the second printing process to form a conductive plug in the hole.
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