公开(公告)号：US11686637B2

公开(公告)日：2023-06-27

申请号：US17583392

申请日：2022-01-25

Applicant: XI'AN JIAOTONG UNIVERSITY

Inventor： Xudong Fang ,  Ziyan Fang ,  Chen Wu ,  Hao Sun ,  Libo Zhao ,  Bian Tian ,  Zhuangde Jiang ,  Wubin Deng ,  Bonan Gao ,  Junxia Wu ,  Songli Wang ,  Nan Zhu

IPC: G01L9/00 ,  B81B7/02

CPC classification number: G01L9/005 ,  B81B7/02 ,  G01L9/0054 ,  B81B2201/0264 ,  B81B2201/0278

Abstract: A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.