公开(公告)号：US09153760B2

公开(公告)日：2015-10-06

申请号：US13990421

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: H05K3/00 ,  H05K7/20 ,  H01L33/64 ,  H05K1/02 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L33/64 ,  H01L21/4878 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

Abstract translation: 制造大功率LED的散热结构的方法包括：（1）制备PCB板，在其一侧具有导热柱的导热板和散热板; （2）提供穿过PCB板的两侧的定位孔，并将铜板焊接到PCB板的一侧，同时将电极焊脚焊接到PCB板的另一侧; （3）将导热柱放入定位孔，将铜板和导热板焊接在一起; （4）将由步骤（3）制成的单件导热板和PCB板放置在压制设备上以调节导电柱的高度; （5）将散热板的内侧固定在导热板的另一侧。

公开(公告)号：US20130248584A1

公开(公告)日：2013-09-26

申请号：US13989818

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: B23K31/02

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract translation: 制作大功率LED散热结构的工艺包括：（1）提供PCB板，导热板和散热板; （2）提供穿过PCB板的第一定位孔和第一固定孔，并将铜板焊接到PCB板的一侧; 同时将电极焊接脚焊接到PCB板的另一侧; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）使用固定柱穿过用于将PCB板和导热板连接在一起的两个固定孔; （5）使用导热柱刺穿两个定位孔; （6）将导热板和PCB板的一体放置在压制设备上以调节导热柱的高度。

公开(公告)号：US08757473B2

公开(公告)日：2014-06-24

申请号：US13989818

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: B23K31/02

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract translation: 制作大功率LED散热结构的工艺包括：（1）提供PCB板，导热板和散热板; （2）提供穿过PCB板的第一定位孔和第一固定孔，并将铜板焊接到PCB板的一侧; 同时将电极焊接脚焊接到PCB板的另一侧; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）使用固定柱穿过用于将PCB板和导热板连接在一起的两个固定孔; （5）使用导热柱刺穿两个定位孔; （6）将导热板和PCB板的一体放置在压制设备上以调节导热柱的高度。

公开(公告)号：US20130298396A1

公开(公告)日：2013-11-14

申请号：US13990421

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: H01L33/64

CPC classification number: H01L33/64 ,  H01L21/4878 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

Abstract translation: 制造大功率LED的散热结构的方法包括：（1）制备PCB板，在其一侧具有导热柱的导热板和散热板; （2）提供穿过PCB板的两侧的定位孔，并将铜板焊接到PCB板的一侧，同时将电极焊脚焊接到PCB板的另一侧; （3）将导热柱放入定位孔，将铜板和导热板焊接在一起; （4）将由步骤（3）制成的单件导热板和PCB板放置在压制设备上以调节导电柱的高度; （5）将散热板的内侧固定在导热板的另一侧。