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    Method for fabricating electrical connection structure of circuit board
    1.
    发明授权
    Method for fabricating electrical connection structure of circuit board 有权
    电路板电连接结构的制造方法

    公开(公告)号：US07340829B2

    公开(公告)日：2008-03-11

    申请号：US10972146

    申请日：2004-10-25

    Applicant: Ying-Tung Wang

    Inventor： Ying-Tung Wang

    IPC: H01K3/10

    CPC classification number: H05K3/242 ,  B23K3/0623 ,  B23K2101/42 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0367 ,  H05K2201/09054 ,  H05K2201/09481 ,  H05K2203/0152 ,  H05K2203/043 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.

    Abstract translation: 提出了一种用于制造电路板的电连接结构的方法。 电路板在其表面上设置有多个焊盘，并且其中具有多个导电结构，用于电连接焊盘。 形成穿过设置在电路板上的绝缘层的多个开口以露出衬垫。 随后，将导电基底连接到电路板的一个表面，用于电连接该焊盘。 通过这样的布置，可以通过电镀工艺通过电镀工艺在电路板的另一个表面上的焊盘上形成导电材料，该电镀基底，表面上的焊盘以及电路板内的导电结构。

    Processing apparatus for electroplating conductive bumps on organic circuit board
    2.
    发明申请
    Processing apparatus for electroplating conductive bumps on organic circuit board 审中-公开
    用于在有机电路板上电镀导电凸块的处理装置

    公开(公告)号：US20060252247A1

    公开(公告)日：2006-11-09

    申请号：US11429886

    申请日：2006-05-08

    Applicant: Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

    Inventor： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

    IPC: H01L21/44

    CPC classification number: H05K3/243 ,  H01L2224/11 ,  H05K3/26 ,  H05K2203/0392 ,  H05K2203/054 ,  H05K2203/0723

    Abstract: A processing apparatus for electroplating conductive bumps on an organic circuit board includes a surface cleaning unit for removing organic contaminant on the surface of conductive layer on the circuit board, a rinsing unit for rinsing the surface of conductive layer, a surface activating unit for removing a metal oxide on the surface of conductive layer, and an electroplating unit for electroplating a conductive bump on the exposing surface of the conductive layer. Thus, the conductive bumps are formed on the circuit board by electroplating. As a result, the alignment is easier, the bonding strength is reinforced, and the requirement for high density fine-pitch bumps is met

    Abstract translation: 一种用于在有机电路板上电镀导电凸块的处理设备包括：用于去除电路板上导电层表面上的有机污染物的表面清洁单元，用于冲洗导电层表面的漂洗单元，用于去除 导电层表面上的金属氧化物，以及用于在导电层的暴露表面上电镀导电凸块的电镀单元。 因此，通过电镀在电路板上形成导电凸块。 结果，对准更容易，结合强度得到加强，满足了高密度细间距凸块的要求

    Method for fabricating electrical connection structure of circuit board
    3.
    发明申请
    Method for fabricating electrical connection structure of circuit board 有权
    电路板电连接结构的制造方法

    公开(公告)号：US20060000877A1

    公开(公告)日：2006-01-05

    申请号：US10972146

    申请日：2004-10-25

    Applicant: Ying-Tung Wang

    Inventor： Ying-Tung Wang

    IPC: B23K31/02

    CPC classification number: H05K3/242 ,  B23K3/0623 ,  B23K2101/42 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0367 ,  H05K2201/09054 ,  H05K2201/09481 ,  H05K2203/0152 ,  H05K2203/043 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.

    Abstract translation: 提出了一种用于制造电路板的电连接结构的方法。 电路板在其表面上设置有多个焊盘，并且其中具有多个导电结构，用于电连接焊盘。 形成穿过设置在电路板上的绝缘层的多个开口以露出衬垫。 随后，将导电基底连接到电路板的一个表面，用于电连接该焊盘。 通过这样的布置，可以通过电镀工艺通过电镀工艺在电路板的另一个表面上的焊盘上形成导电材料，该电镀基底，表面上的焊盘以及电路板内的导电结构。

    Method for fabricating circuit board with conductive structure
    5.
    发明授权
    Method for fabricating circuit board with conductive structure 有权
    制造导电结构电路板的方法

    公开(公告)号：US07350298B2

    公开(公告)日：2008-04-01

    申请号：US11467629

    申请日：2006-08-28

    Applicant: Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen Hung Hu ,  Chao Wen Shih

    Inventor： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen Hung Hu ,  Chao Wen Shih

    IPC: H01K3/10 ,  H05K3/02 ,  H05K3/34

    CPC classification number: H05K3/3484 ,  H05K1/112 ,  H05K3/1216 ,  H05K3/243 ,  H05K3/3473 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.

    Abstract translation: 公开了一种制造具有导电结构的电路板的方法。 该方法包括：分别在电路板的第一和第二表面上形成第一和第二绝缘保护层; 在所述第一绝缘保护层和所述开口上形成导电层; 分别在导电层和第二绝缘保护层上形成第一和第二抗蚀剂层; 通过在所述第一抗蚀剂层的开口中的多个第一和第二电连接焊盘上的暴露的导电层上电镀来形成第一电连接结构; 去除由第一抗蚀剂层覆盖的第一和第二抗蚀剂层和导电层; 以及通过在第一表面上的第二电连接焊盘和电路板的第二表面的多个第三电连接焊盘上的导电层上的模版印刷形成第二电连接结构。

    Method for fabricating electrical connection structure of circuit board
    7.
    发明申请
    Method for fabricating electrical connection structure of circuit board 有权
    电路板电连接结构的制造方法

    公开(公告)号：US20060079081A1

    公开(公告)日：2006-04-13

    申请号：US11250110

    申请日：2005-10-12

    Applicant: Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

    Inventor： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

    IPC: H01L21/4763

    CPC classification number: H05K3/243 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0574 ,  H05K2203/0723

    Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

    Abstract translation: 提出了一种用于制造电路板的电连接结构的方法。 在具有多个导电焊盘的电路板上形成图案化的抗蚀剂层，并且在抗蚀剂层中形成多个开口以露出导电焊盘。 第一导电材料和第二导电材料依次沉积在抗蚀剂层的开口和每个导电焊盘上。 然后，除去抗蚀剂层。 随后，将保护层施加在电路板上并覆盖形成在每个导电焊盘上的第一和第二导电材料。 最后，保护层被稀薄以将与其相对应的第二导电材料暴露于每个导电焊盘。 因此，电路板可以经由第二导电材料电连接到外部装置。

    PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME 审中-公开
    包装基材及其制造方法

    公开(公告)号：US20120164854A1

    公开(公告)日：2012-06-28

    申请号：US13236855

    申请日：2011-09-20

    Applicant: Ying-Tung Wang

    Inventor： Ying-Tung Wang

    IPC: H01R12/71 ,  H05K3/00

    CPC classification number: H05K3/4007 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11462 ,  H01L2224/11622 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/01029 ,  H05K2201/0367 ,  Y10T29/49124

    Abstract: A packaging substrate is proposed, which includes: a circuit layer formed on a substrate and having conductive pads, an insulating protective layer formed on the substrate for covering the circuit layer and having openings for correspondingly exposing the conductive pads; copper bumps each having a connection portion formed in a corresponding one of the openings and electrically connected to a corresponding one of the conductive pads, and a protruding portion integrally connected to the connection portion and extending to a portion of the insulating protective layer surrounding the corresponding one of the openings, allowing the protruding portion to be greater in diameter than the connection portion, and a surface treatment layer having an electroplated nickel material formed on top surfaces of the protruding portions of the copper bumps, and an electroplated gold material formed on the electroplated nickel material. The surface treatment layer is not formed on side surfaces of the protruding portions, such that the thickness of the surface treatment layer is irrelevant to the diameter of the protruding portion.

    Abstract translation: 提出了一种封装基板，其包括：形成在基板上并具有导电焊盘的电路层，形成在基板上用于覆盖电路层并具有用于相应地暴露导电焊盘的开口的绝缘保护层; 铜凸块各自具有形成在对应的一个开口中的电连接到相应的一个导电焊盘的连接部分，以及与连接部分一体连接并延伸到围绕相应的绝缘保护层的一部分的突出部分 一个开口，允许突出部分的直径大于连接部分的直径;以及表面处理层，其具有形成在铜凸块的突出部分的顶表面上的电镀镍材料，以及形成在该凸起部分上的电镀金材料 电镀镍材料。 表面处理层不形成在突出部分的侧表面上，使得表面处理层的厚度与突出部分的直径无关。

    Method for fabricating electrical connections of circuit board
    10.
    发明授权
    Method for fabricating electrical connections of circuit board 有权
    电路板电气连接方法

    公开(公告)号：US07216424B2

    公开(公告)日：2007-05-15

    申请号：US11023363

    申请日：2004-12-29

    Applicant: Ying-Tung Wang

    Inventor： Ying-Tung Wang

    IPC: H05K3/02 ,  H05K3/06 ,  H05K3/40

    CPC classification number: H05K3/3473 ,  B23K35/02 ,  H05K3/0035 ,  H05K3/243 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2203/043 ,  H05K2203/0505 ,  H05K2203/054 ,  H05K2203/0723 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49204

    Abstract: A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit board and has a plurality of openings for exposing the electrical connection pads. A conductive layer is formed on the protective layer and the electrical connection pads. A resist layer is applied on the conductive layer and has a set of openings for exposing a portion of the conductive layer covering some of the electrical connection pads. A first metal layer is electroplated in the openings of the resist layer. Another set of openings are formed through the resist layer corresponding to the rest of the electrical connection pads. A second metal layer is electroplated on the first metal layer and above the rest of the electrical connection pads to form different electrical connections on the circuit board.

    Abstract translation: 提供一种用于制造电路板的电连接的方法。 电路板上有多个电连接焊盘。 保护层被施加在电路板上，并且具有用于暴露电连接焊盘的多个开口。 在保护层和电连接焊盘上形成导电层。 将抗蚀剂层施加在导电层上并具有一组用于暴露覆盖一些电连接焊盘的导电层的一部分的开口。 将第一金属层电镀在抗蚀剂层的开口中。 通过与其余电连接焊盘对应的抗蚀剂层形成另一组开口。 第二金属层电镀在第一金属层上并在电连接焊盘的其余部分上方，以在电路板上形成不同的电连接。

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