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公开(公告)号：US20170283256A1
公开(公告)日：2017-10-05
申请号：US15479154
申请日：2017-04-04
Applicant: mCube, Inc.
Inventor： Ben LEE , Ming Hong KUO , Wen-Chih CHEN , Wensen TSAI
CPC classification number: B81C99/0045 , B81C99/005 , G01R1/0433 , G01R31/2607 , H01L21/67132
Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.
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公开(公告)号：US20180346328A1
公开(公告)日：2018-12-06
申请号：US16102592
申请日：2018-08-13
Applicant: mCube, Inc.
Inventor： Ben LEE , Ming Hong KUO , Wen-Chih CHEN , Wensen TSAI
CPC classification number: B81C99/0045 , B81C99/005 , G01R1/0433 , G01R31/2607 , H01L21/67132
Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.
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公开(公告)号：US20170248628A1
公开(公告)日：2017-08-31
申请号：US15444162
申请日：2017-02-27
Applicant: mCube, Inc.
Inventor： Sanjay BHANDARI , Ken WANG , Ben LEE
CPC classification number: G01P15/08 , B81B7/0074 , B81B7/0087 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , G01P15/0802 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.
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